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Articles Tagged with ''devices''
Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, introduces its next-generation, UltraCMOS PE4312 DSA. Successor to the popular PE4302 – which boasts more than 35 million units shipped since its introduction – the new PE4312 enables flexible, wide dynamic-range network-infrastructure designs that require highly accurate and efficient amplitude control. This DSA upgrade is ideally suited for wireless-infrastructure devices, broadband consumer and infrastructure equipment, land mobile radios (LMRs), test-and-measurement equipment and military RF applications.
Richardson RFPD Inc. announces immediate availability and full design support capabilities for five new gallium nitride (GaN) on silicon carbide (SiC) high-electron-mobility transistors (HEMTs) RF transistors from M/A-COM Technology Solutions (MACOM).
RFMW Ltd. announces design and sales support forwideband, DC-3.5GHz GaN transistors from TriQuint. Available as the T2G4003532-FS earless package or the T2G4003532-FL, both transistors are input prematched for S-band operation. The devices are constructed with TriQuint's proven TQGaN25 process, which features advanced field plate techniques to optimize power and efficiency at high drain bias operating conditions.
API Technologies Corp., a leading provider of high performance RF/microwave, power and security solutions for critical and high-reliability applications, introduces a new line of standard switched filter bankswith customer-specified frequency bands from 2 to 7 channels. With lead times as fast as four weeks, the configurable solution significantly reduces development cycle time, resulting in cost savings and faster time to market.
Anite, a global leader in wireless equipment testing technology, announced that it is first to offer chipset and device manufacturers the ability to verify their 4x4 Downlink (DL) MIMO designs and products, accelerating the development of LTE and LTE-Advanced devices. The milestone was achieved in close collaboration with a leading device manufacturer using Anite’s Development Toolset - an easy to use solution for early stage testing..
Cree has added four new gallium nitride (GaN) high electron mobility transistors (HEMTs) to its product portfolio at Digi-Key, the sole distributor for Cree RF components. Respectively based on Cree’s high power density 50V, 0.25μm and 0.4μm GaN on silicon carbide (SiC) foundry processes, the new X-Band and S-Band components exhibit high efficiency, high power gain, and wide bandwidth capabilities.
GE MEMS switch technology demonstrates performance which could meet demands for next-generation “True 4G” mobile devices
With a combined history exceeding 175 years, Dielectric Laboratories (DLI), Novacap, Syfer Technology and Voltronics have come together into a single organisation, Knowles Capacitors. This new entity is a division of Knowles Corp. of USA, an independent publicly traded company. A result of the merging of some of the world’s leading speciality capacitor manufacturers, Knowles Capacitors becomes one team of great people sharing a common vision.
Richardson RFPD introduces 400L Series precision tolerance, thin film NPO RF microwave capacitors from ATC
Richardson RFPD Inc. announces immediate availability and full design support capabilities of the 400L Series of precision tolerance, thin film NPO RF and microwave capacitors from American Technical Ceramics Corp. (ATC).
Sonnet Software Inc. introduces Blink™, the first multi-solver passive device modeling suite, now available for purchase. Blink operates entirely from within the Cadence® Virtuoso® environment and is used for the analysis of on-chip passive devices such as spiral inductors and MIM capacitors.