Peregrine Semiconductor Corp., a fabless provider of high-performance radio-frequency (RF) integrated circuits (IC), announced that it has shipped its billionth CMOS-on-sapphire RFIC and has been designed into the world’s most sought-after smartphones.
Achieving another wireless connectivity milestone, Texas Instruments Inc. (TI) introduced the WiLink™ 8.0 product family, a collection of 45-nanometer single-chip solutions that integrate up to five different radios, and set the stage for next-generation mobile Wi-Fi®, GNSS, NFC, Bluetooth® and FM transmit/receive applications.
Anritsu Co. announced its MP1800A BER Tester was part of a live demonstration of 25-28 Gb/s CDR retimers designed to support emerging 100 Gb/s networking applications that was conducted by Gennum Corp., a supplier of high-speed optical, analog and mixed signal semiconductor solutions.
RF Micro Devices Inc. (RFMD), a designer and manufacturer of high-performance radio frequency components and compound semiconductor technologies, announced the release of the RFFM6201, a 2.4 GHz band single-chip Zigbee® front-end module (FEM) featuring an integrated power amplifier, low noise amplifier and diversity switch.
TriQuint Semiconductor Inc. announced that it has begun work on Phase II of the Defense Advanced Research Projects Agency (DARPA) multi-year Nitride Electronic NeXt-Generation Technology (NEXT) program as a prime contractor.