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Articles Tagged with ''devices''

Anritsu earns GCF approval

Anritsu Co. announces it has met the GCF Test Platform Approval Criteria (TPAC) and its LTE-Advanced RF/RRM Conformance Test System (CTS) ME7873LA is the world’s first GCF-approved platform providing both RF and RRM TPACs for three downlink carrier aggregation (3DL CA) RF Conformance Tests. Anritsu holds the largest number of GCF TPACs for WI-231, enabling 3CC CA certification of devices for GCF. This leadership position was reached based on approvals gained at the recent CAG#46 meeting held April 26-27, 2016 in New Jersey.


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Mobile Experts: Wi-Fi semiconductor market to reach more than $12B in 2020

Mobile Experts released a new report on Wi-Fi Semiconductors, highlighting the trends in combo chips, SoCs, power amplifiers, LNAs, switches, and Front End Modules (FEMs). The report covers both access point hardware and client devices, with detailed information regarding the trends to higher levels of integration, higher level MIMO, new standards, and changes in semiconductor process technologies.


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Pulse Electronics introduces SMT Power Inductors for small electronic devices

Pulse Electronics Corp. announces the release of a family of six new ultra-low profile SMT shielded inductors for compact point-of-load and mobile devices. With mounted height profiles of 1.0 to 3.2 mm, these inductors are ideal for today's mobile computing, home automation, portable POS and other small handheld devices.


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