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Articles Tagged with ''chip''
Sumitomo Electric Device Innovations USA Inc. (SEDU), a provider of advanced wireless and optical communications solutions, will showcase its E-band MMICs for radio link applications at IMS 2012 in Montreal.
Researchers at MIT have found a new way of making complex three-dimensional structures using self-assembling polymer materials that form tiny wires and junctions. The work has the potential to usher in a new generation of microchips and other devices made up of submicroscopic features.