Articles Tagged with ''chip''

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Recognized throughout the semiconductor and electronic design industries as the premiere annual trade event, DesignCon 2013 is scheduled for January 28-31 in Santa Clara, Calif.  Hosted by UBM Electronics, the daily source of essential business and technical information for the electronics industry’s decision makers, the 14-track technical DesignCon conference program will include more than 100 in-depth tutorials, technical paper sessions and panel discussions.

The new RAVS series from Stackpole offers stable reliable performance in a wide variety of environments including those with high amounts of sulfur. Stackpole’s proprietary process and materials with reduced silver yield a chip resistor array with excellent long-term reliability under conditions where standard chip resistors fail. The RAVS series shows typical resistance shifts less than 0.1 percent after 240 hours at 40C, 95 percent R.H., 5 volt bias, and H2S concentration of 3 ppm or greater.

AVX Corp., a leading manufacturer of passive components and interconnect solutions, has introduced a new series of Schottky barrier rectifier diodes uniquely packaged as lead-less chips. Eliminating the standard lead frame wire bond provides the chip with top-bottom symmetry, which enables better heat transfer, better current handling capability than SOD devices, and fewer mounting problems.  Available in several case sizes and a range of current values spanning 0.1A to 8A, the new lead-less chip form Schottky rectifier diodes are ideal for applications including switch mode power supplies, high frequency rectification, portable battery powered devices, and reverse bias protection. 

Ethertronics, a leading technology company enabling innovative antenna and RF system solutions to deliver the best connected experience, announced that the company achieved a more than 50 percent increase in revenue from 2011 to 2012, reinforcing its continued growth in the global market. The company’s solutions are now integrated in more than 1,000 product designs. In addition to its continued momentum in providing products to OEMs worldwide, Ethertronics achieved major milestones in 2012 related to the diversification of its business.

Stackpole's RAVN Series is a thin film based chip array designed for applications with tight tolerance or tight TCR requirements. The Series offers four resistive elements in a 1.6 x 3.2 mm package with resistance values from 100 Ω up to 33 K Ω in a 0.1 percent tolerance. 

International Manufacturing Services Inc. (IMS) introduces its line of HVI Series chip resistors especially suited for high voltage applications.

Aeroflex/Inmet Inc. and Modelithics Inc. have teamed to develop Global™ Models for Aeroflex/ Inmet surface mount attenuators (PCAF and PCAAF series) and high power chip resistors (NPC50-50W and NPC50-100W series). The advanced model features include  substrate scaling, pad geometry scaling and part value selectability.

To meet the demanding needs of pyrotechnic engineers, Vishay Intertechnology Inc. introduced a new massive electro-pyrotechnic ignitor chip (MEPIC) resistor offering Joule effect or flash ignition for fast firing times down to 250 µs.

ABI Research reports that Broadcom has put into production one of the world’s smallest multimode (GSM/GPRS/EDGE/UMTS) transceivers. The sub 7 sq. mm. 40nm RF chip (BCM2193) was revealed just one week after the discovery of the 40nm RF chip announced last week. Broadcom’s chip was discovered second but it may actually have hit production a week or two prior to the Mediatek solution.

International Manufacturing Services Inc. (IMS), a manufacturer of high quality thick film resistors, terminations, attenuators, couplers, thermal management devices, planar dividers and planar filters to the electronics industry, has introduced a new type of chip resistor terminal which are non-magnetic and ultra leach resistant.