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Articles Tagged with ''chip''

UTAC and AT&S collaborate on turnkey supply for 3D SiP solutions

UTAC Holdings Ltd. (UTAC), one of the leading semiconductor assembly and test services provider in Asia, announced a joint collaboration with AT&S, one of the global leading manufacturers of high-end printed circuit boards (PCBs) with headquarters in Leoben, Austria, to provide complete turnkey supply chain solutions for three-dimensional system-in-package (“3D SiP”) requirements.


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Sony acquires Altair Semiconductor, Israeli innovator of LTE modem chip technology

Sony Corp. has reached an agreement with Altair Semiconductor and its major shareholders to acquire the company. The purchase price is $212 million (approximately 25 billion yen), and Sony expects to complete the acquisition in early February 2016. Altair, an Israel-based company, owns modem chip technology and related software for LTE (Long Term Evolution), a 4G cellular standard for mobile devices. Altair develops and sells products focused on LTE technology, and its modem chips stand out for their low power consumption, high performance and competitive cost.


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Anritsu completes testing of GCT Semiconductor's LTE-Advanced single chip

Anritsu Co. announces it successfully completed testing of GCT Semiconductor’s 4G LTE-Advanced chip, GDM7243Q, using Anritsu’s MD8430A signaling tester with Rapid Test Designer (RTD). GCT Semiconductor, a leading designer and supplier of advanced 4G mobile semiconductor solutions, offers an advanced FDD-TDD LTE Category 5/6/7 single chip, with the world’s first 4X4 MIMO carrier aggregation for LTE.


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EMC Technology's diamond termination offers 300 W power handling to 12 GHz

RFMW Ltd. announces design and sales support for the CT2010D from EMC Technology. The CT2010D diamond termination offers 300 W CW power handling in a chip size (2.67 x 5.21 mm), SMT package. EMC Diamond RF Resistives® offer high performance in compact packages. EMC’s CVD Diamond terminations surpass BeO and AlN terminations with operation up to 30 GHz.


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Vishay launches series of surface-mount solid tantalum chip capacitors

Vishay Intertechnology, Inc. introduced a new TANTAMOUNT® Hi-Rel COTS series of surface-mount solid tantalum chip capacitors for military and avionics applications. The industry's first such devices to feature a metal case and hermetic sealing to meet the requirements of MIL-STD-202, Method 112, Condition A, the Vishay Sprague T25 series offers low ESR down to 180 mΩ at +25 °C and 100 kHz and is available with surge current testing options in accordance with MIL-PRF-55365.


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