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Articles Tagged with ''laminates''

Liquid-Crystal-Polymer Laminates: ULTRALAM 3850HT

Rogers Corp. unveiled its ULTRALAM® 3850HT liquid-crystal-polymer (LCP) laminates for simplified and improved construction of multilayer circuit boards at higher temperatures. With a melt temperature of +330°C, ULTRALAM 3850HT circuit materials are adhesiveless laminates that use LCP as the dielectric film to deliver high yields in single-layer and multilayer circuit constructions. These laminates are well suited for high-speed and high-frequency circuit applications.


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Rogers highlights latest circuit materials & PCB techniques at IPC APEX EXPO

Rogers Corp. will be promoting its industry-leading printed circuit board (PCB) materials at the IPC APEX EXPO, being held March 25-27, 2014 at the Mandalay Bay Resort & Convention Center (Las Vegas, NV). The IPC APEX EXPO, with more than 400 exhibiting companies and thousands of attendees, is a leading industry event for professionals involved in PCB design and manufacturing and electronic assembly and test.


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Isola expands production of GETEK materials in Germany to support european OEMs

Isola Group S.à r.l., a market leader in dielectric materials used to fabricate advanced multilayer printed circuit boards, announced that GETEK® laminates and prepegs are now in production at its facility in Düren, Germany, which will shorten lead times to Isola’s European customers. GETEK materials provide the low-dielectric constant and low-dissipation factors  demanded by high-speed, low-loss printed circuit board designs and applications, while providing superior thermal performance and high reliability based on the system’s 180°C glass transition temperature (Tg).


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Isola introduces ultra-low loss materials for applications over 100 Gbps

Isola Group S.à r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), announced that it has begun alpha testing of Tachyon, its new ultra-low loss product that is engineered to reduce insertion loss on high-peed digital designs. It is specifically being targeted for high-layer count backplanes for the growing 100 gigabit per second (Gbps) market that has channel data rates in excess of 25 Gbps.


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