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Articles Tagged with ''laminates''

Rogers Corp. to exhibit high performance circuit materials at IMS2016

Rogers Corp. is exhibiting at the 2016 IEEE MTT-S International Microwave Symposium (IMS) May 24-26, at the Moscone Center in San Francisco, Calif., Booth #2039. IEEE MTT-S IMS is the microwave industry’s largest international gathering of RF/microwave professionals, with over 600 exhibition booths and more than 8,000 attendees expected.


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Rogers Corp. to showcase advanced connectivity material solutions at IPC APEX EXPO 2016

Rogers Corp. will be exhibiting at the upcoming IPC APEX Expo scheduled for March 15-17 at the Las Vegas Convention Center, Las Vegas, Nev. Representatives from Rogers Corp. will be exhibiting at Booth #607, providing information and insight on the use of their circuit materials, including ULTRALAM® 3850HT, CLTE-XT™, TC350™ RO3003™ and XT/duroid® laminates. Rogers will also be previewing its new material system developed for extremely low loss digital applications.


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Rogers Corp. to exhibit and educate at DesignCon 2016

Rogers Corp. will be exhibiting and educating at the upcoming DesignCon show. Now in its 21st year, DesignCon is a premiere event for design chip-circuit-and system-level engineers working on high-frequency analog and high-speed digital circuits. DesignCon 2016 is scheduled for January 19-21, 2016 (January 20-21 for the exhibition) at the Santa Clara Convention Center in Santa Clara, Calif.


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Liquid-Crystal-Polymer Laminates: ULTRALAM 3850HT

Rogers Corp. unveiled its ULTRALAM® 3850HT liquid-crystal-polymer (LCP) laminates for simplified and improved construction of multilayer circuit boards at higher temperatures. With a melt temperature of +330°C, ULTRALAM 3850HT circuit materials are adhesiveless laminates that use LCP as the dielectric film to deliver high yields in single-layer and multilayer circuit constructions. These laminates are well suited for high-speed and high-frequency circuit applications.


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