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Articles Tagged with ''paste''
Indium Corp. will feature its new high-melting lead-free solder paste technology, BiAgX™, at Semicon China on March 18-20 in Shanghai, China.
Indium Corp. announces that Glen Thomas has been named product manager for PCB assembly solder paste.
Indium Corp. introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium’s unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.
Indium Corp. will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in Münich, Germany.
Photo Stencil LLC, a leading full-service provider of high-performance stencils and tooling, will present the papers, Printing and Assembly Challenges for QFN Devices and Two Print Stencils Process at IPC APEX 2013. Videos of the presenters describing these papers can be found at www.photostencil.com/apex2013.php.