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Articles Tagged with ''paste''

Indium Corp. features new, high temperature, lead-free solder paste technology at Semicon China

March 4, 2014

Indium Corp. will feature its new high-melting lead-free solder paste technology, BiAgX™, at Semicon China on March 18-20 in Shanghai, China. 


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Indium Corp. hires Glen Thomas as product manager for solder paste

January 30, 2014

Indium Corp. announces that Glen Thomas has been named product manager for PCB assembly solder paste.  


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Indium8.9HF1-P delivers high first pass yields for in-circuit testing

December 10, 2013

Indium Corp. introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium’s unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.


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Indium Corp. features new, high-reliability solder alloy SACM at Productronica

October 30, 2013

Indium Corp. will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in Münich, Germany. 


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Photo Stencil to present two papers at IPC APEX 2013

January 30, 2013

Photo Stencil LLC, a leading full-service provider of high-performance stencils and tooling, will present the papers, Printing and Assembly Challenges for QFN Devices and Two Print Stencils Process at IPC APEX 2013. Videos of the presenters describing these papers can be found at www.photostencil.com/apex2013.php.


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