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Articles Tagged with ''chipset''

Anritsu LTE protocol conformance tester first solution to exceed 10,000 test cases

Anritsu Corp. announces it is the first test equipment manufacturer to exceed 10,000 validated protocol conformance test cases across all Work Items and frequency bands for LTE and LTE Inter-RAT. The milestone, achieved at the recent GCF CAG#33 meeting in Farnborough, UK, was accomplished on the ME7834 Mobile Device Test Platform.


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Microsemi introduces world's first SiGe-based, monolithic RF FE device designed for 5G WiFi platforms

Microsemi Corp., a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, delivered the world's first monolithic silicon germanium (SiGe) RF front-end (FE) device for the 5th generation of Wi-Fi devices based on IEEE 802.11ac standard. Benefitting from its industry-leading integration levels and utilizing high-performance SiGe process technology, the new LX5586 RF FE provides significant performance and cost advantages over existing technologies.  


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Wireless connectivity chipsets revenues to exceed $10 B in 2012

The total market for standards-based wireless connectivity chipsets is expected to exceed $10 billion in 2012, this includes both standalone and combo chipsets that use Bluetooth, Wi-Fi, GPS, NFC, UWB, and ZigBee. “The market continues to develop with technologies - particularly Bluetooth and Wi-Fi - squaring up for a fight to be the dominant standard,” commented Peter Cooney, wireless connectivity practice director.


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RFMD introduces WiFi front end modules at IMS 2012

RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD’s FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world’s leading WiFi chipset providers.


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RFMD introduces WiFi front end modules at IMS 2012

RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD's FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world's leading WiFi chipset providers.


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Agilent's Bluetooth RF test solution speeds development of devices based on TI ICs

Agilent Technologies Inc. announced its Bluetooth low-energy test solution on the N4010A wireless connectivity test set was verified by Texas Instruments Inc. for use with TI’s integrated circuits in Bluetooth Smart and Smart-Ready devices. The Bluetooth low-energy Tx/Rx test capability on N4010A gives manufacturers and design houses reliable and efficient test solutions for single-mode and dual-mode devices.


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Highly integrated IC radio solution for low cost 60 GHz radio applications

Hittite Microwave Corp. announces the release of the highly integrated HMC6000/6001 silicon transceiver chipset which targets 60 GHz applications such as: metrocell/picocell backhaul, WiGig (IEEE 802.11ad) multi-Gbps solutions including wireless cable replacement (HDMI, USB 3.0, DisplayPort), wireless docking stations, video/magazine kiosks and wireless sensors.


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