Ted Rappaport, founding director of NYU WIRELESS and a leading proponent of using the millimeter wave spectrum for wireless communications, discusses the FCC's recent rulemaking actions and technology developments that are paving the way to 5G.
Anite, a global leader in wireless testing technology, announced that, by working in close collaboration with leading chipset manufacturers, it has achieved peak data rates with commercial devices for LTE-Advanced (LTE-A) carrier aggregation.
Altair Semiconductor (www.altair-semi.com), a developer of high performance, single-mode LTE chipsets, announced the launch ofa new family of chipsets, which includes two new baseband processors – the FourGee™-3800 and FourGee™-3802 – and a new radio chip – the FourGee™-6300.
Anritsu Corp. announces it is the first test equipment manufacturer to exceed 10,000 validated protocol conformance test cases across all Work Items and frequency bands for LTE and LTE Inter-RAT. The milestone, achieved at the recent GCF CAG#33 meeting in Farnborough, UK, was accomplished on the ME7834 Mobile Device Test Platform.
Microsemi Corp., a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, delivered the world's first monolithic silicon germanium (SiGe) RF front-end (FE) device for the 5th generation of Wi-Fi devices based on IEEE 802.11ac standard. Benefitting from its industry-leading integration levels and utilizing high-performance SiGe process technology, the new LX5586 RF FE provides significant performance and cost advantages over existing technologies.
The total market for standards-based wireless connectivity chipsets is expected to exceed $10 billion in 2012, this includes both standalone and combo chipsets that use Bluetooth, Wi-Fi, GPS, NFC, UWB, and ZigBee. “The market continues to develop with technologies - particularly Bluetooth and Wi-Fi - squaring up for a fight to be the dominant standard,” commented Peter Cooney, wireless connectivity practice director.
RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD’s FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world’s leading WiFi chipset providers.
M/A-COM Technology Solutions Inc. (M/A-COM Tech) introduced at the International Microwave Symposium (IMS/MTT-S) Trade Show, in Montreal, Canada, a 42GHz SMARTSET Chipset for point-to-point radio applications.
RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD's FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world's leading WiFi chipset providers.
GigOptix, Inc., a leading fabless supplier of semiconductor and optical components that enable high speed information streaming, announced that it will showcase its portfolio of wideband and E-band solutions at the International Microwave Symposium (IMS2012) in Montreal, Canada on June 17-22, 2012.
Agilent Technologies Inc. announced its Bluetooth low-energy test solution on the N4010A wireless connectivity test set was verified by Texas Instruments Inc. for use with TI’s integrated circuits in Bluetooth Smart and Smart-Ready devices. The Bluetooth low-energy Tx/Rx test capability on N4010A gives manufacturers and design houses reliable and efficient test solutions for single-mode and dual-mode devices.