Linear Technology Corp. introduces the LTC4290/LTC4271 isolated 8-port power source equipment (PSE) controller chipset designed for use in IEEE 802.3at (PoE+) Type 1- and Type 2-compliant Power-over-Ethernet (PoE) systems. The LTC4290/4271 provides 8 independent PSE channels for simpler lower component count designs, reduced board space and ultimately reduced total solution costs.
Azimuth Systems Inc., a provider of automated, real-world mobile performance test solutions, announced the availability of AzMapper 2.5, the latest version of its mapping and analysis application for real world performance testing. AzMapper, a critical component of Azimuth’s Field-to-Lab™ solution, enables raw data collected with drive test scanners to be thoroughly analyzed and used to recreate that same radio environment through intelligent mapping of the logged field conditions to the available lab testbed.
ABI Research finds that Mediatek has delivered the world’s smallest multimode transceiver. Coming just a week after Qualcomm announced its intentions to produce RF front ends for high tier LTE smartphones, Mediatek releases the world’s smallest RF transceiver which is also the world’s first 40 nm transceiver.
Anite, a global leader in wireless testing technology, announced that, by working in close collaboration with leading chipset manufacturers, it has achieved peak data rates with commercial devices for LTE-Advanced (LTE-A) carrier aggregation.
Altair Semiconductor (www.altair-semi.com), a developer of high performance, single-mode LTE chipsets, announced the launch ofa new family of chipsets, which includes two new baseband processors – the FourGee™-3800 and FourGee™-3802 – and a new radio chip – the FourGee™-6300.
Anritsu Corp. announces it is the first test equipment manufacturer to exceed 10,000 validated protocol conformance test cases across all Work Items and frequency bands for LTE and LTE Inter-RAT. The milestone, achieved at the recent GCF CAG#33 meeting in Farnborough, UK, was accomplished on the ME7834 Mobile Device Test Platform.
Microsemi Corp., a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, delivered the world's first monolithic silicon germanium (SiGe) RF front-end (FE) device for the 5th generation of Wi-Fi devices based on IEEE 802.11ac standard. Benefitting from its industry-leading integration levels and utilizing high-performance SiGe process technology, the new LX5586 RF FE provides significant performance and cost advantages over existing technologies.
The total market for standards-based wireless connectivity chipsets is expected to exceed $10 billion in 2012, this includes both standalone and combo chipsets that use Bluetooth, Wi-Fi, GPS, NFC, UWB, and ZigBee. “The market continues to develop with technologies - particularly Bluetooth and Wi-Fi - squaring up for a fight to be the dominant standard,” commented Peter Cooney, wireless connectivity practice director.
RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD’s FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world’s leading WiFi chipset providers.
M/A-COM Technology Solutions Inc. (M/A-COM Tech) introduced at the International Microwave Symposium (IMS/MTT-S) Trade Show, in Montreal, Canada, a 42GHz SMARTSET Chipset for point-to-point radio applications.