Articles Tagged with ''chipset''

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Hittite Microwave Corp. announces the release of the highly integrated HMC6000/6001 silicon transceiver chipset which targets 60 GHz applications such as: metrocell/picocell backhaul, WiGig (IEEE 802.11ad) multi-Gbps solutions including wireless cable replacement (HDMI, USB 3.0, DisplayPort), wireless docking stations, video/magazine kiosks and wireless sensors.

Agilent Technologies Inc. announced its Bluetooth low-energy test solution on the N4010A wireless connectivity test set was verified by Texas Instruments Inc. for use with TI’s integrated circuits in Bluetooth Smart and Smart-Ready devices. The Bluetooth low-energy Tx/Rx test capability on N4010A gives manufacturers and design houses reliable and efficient test solutions for single-mode and dual-mode devices.

GigOptix, Inc., a leading fabless supplier of semiconductor and optical components that enable high speed information streaming, announced that it will showcase its portfolio of wideband and E-band solutions at the International Microwave Symposium (IMS2012) in Montreal, Canada on June 17-22, 2012.

RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD's FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world's leading WiFi chipset providers.

M/A-COM Technology Solutions Inc. (M/A-COM Tech) introduced at the International Microwave Symposium (IMS/MTT-S) Trade Show, in Montreal, Canada, a 42GHz SMARTSET Chipset for point-to-point radio applications.

RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD’s FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world’s leading WiFi chipset providers.

The total market for standards-based wireless connectivity chipsets is expected to exceed $10 billion in 2012, this includes both standalone and combo chipsets that use Bluetooth, Wi-Fi, GPS, NFC, UWB, and ZigBee. “The market continues to develop with technologies - particularly Bluetooth and Wi-Fi - squaring up for a fight to be the dominant standard,” commented Peter Cooney, wireless connectivity practice director.

Microsemi Corp., a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, delivered the world's first monolithic silicon germanium (SiGe) RF front-end (FE) device for the 5th generation of Wi-Fi devices based on IEEE 802.11ac standard. Benefitting from its industry-leading integration levels and utilizing high-performance SiGe process technology, the new LX5586 RF FE provides significant performance and cost advantages over existing technologies.  

Anritsu Corp. announces it is the first test equipment manufacturer to exceed 10,000 validated protocol conformance test cases across all Work Items and frequency bands for LTE and LTE Inter-RAT. The milestone, achieved at the recent GCF CAG#33 meeting in Farnborough, UK, was accomplished on the ME7834 Mobile Device Test Platform.