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Articles Tagged with ''solutions''

Mentor Graphics' affordable, high-tech design solutions for independent engineers

Mentor Graphics Corp. announced the delivery of three new PADS® family products starting at unprecedented pricing of five thousand dollars to address the advancing needs of the independent engineer. The new PADS family provides for the wide spectrum of electronics complexity by combining ease of learning and use, characteristic of previous market-leading PADS products, with high-productivity design and analysis technologies and unprecedented price-performance value.


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Anritsu completes testing of GCT Semiconductor's LTE-Advanced single chip

Anritsu Co. announces it successfully completed testing of GCT Semiconductor’s 4G LTE-Advanced chip, GDM7243Q, using Anritsu’s MD8430A signaling tester with Rapid Test Designer (RTD). GCT Semiconductor, a leading designer and supplier of advanced 4G mobile semiconductor solutions, offers an advanced FDD-TDD LTE Category 5/6/7 single chip, with the world’s first 4X4 MIMO carrier aggregation for LTE.


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Teledyne LeCroy introduces a new USB 3.1 end-to-end test suite

Teledyne LeCroy introduces the QPHY-USB3.1-Tx-Rx package for automated USB 3.1 transmitter (Tx) and receiver (Rx) compliance testing, characterization, and debug, creating a unique and comprehensive USB 3.1 test suite. With the new test package, USB 3.1 testing can be performed on both Gen1 (5 Gb/s) and Gen2 (10 Gb/s) devices under test according to the latest USB 3.1 specifications.


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