NXP Semiconductors N.V. announced a partnership with Xiaomi, a global leader in wireless connectivity and security solutions. The agreement will see NXP provide its latest innovative low power wireless connectivity solution for the new Xiaomi Smart Home Suite.
Keysight Technologies Inc. announced it will demonstrate the latest RF, microwave and mmWave design and measurement solutions for R&D, manufacturing and service at the IEEE MTT-S International Microwave Symposium, Booth 739, Phoenix, May 17-22.
API Technologies Corp., a leading provider of high performance RF, microwave, millimeterwave and power solutions, will showcase the company’s latest product solutions spanning communications, aerospace, and defense at the 2015 IEEE MTT-S International Microwave Symposium (IMS 2015) in Booth 3236.
At a Keysight Technologies press conference held at EDI CON China on April 15, which was aimed primarily at the Chinese press Liz Ruetsch, Keysight Technologies strategic marketing manager, based in Beijing, China, focused on the development of 5G technologies.
Mentor Graphics Corp. announced the delivery of three new PADS® family products starting at unprecedented pricing of five thousand dollars to address the advancing needs of the independent engineer. The new PADS family provides for the wide spectrum of electronics complexity by combining ease of learning and use, characteristic of previous market-leading PADS products, with high-productivity design and analysis technologies and unprecedented price-performance value.
Anritsu Co. announces it successfully completed testing of GCT Semiconductor’s 4G LTE-Advanced chip, GDM7243Q, using Anritsu’s MD8430A signaling tester with Rapid Test Designer (RTD). GCT Semiconductor, a leading designer and supplier of advanced 4G mobile semiconductor solutions, offers an advanced FDD-TDD LTE Category 5/6/7 single chip, with the world’s first 4X4 MIMO carrier aggregation for LTE.
IBM announced that it will invest $3 billion over the next four years to establish a new Internet of Things (IoT) unit, and that it is building a cloud-based open platform designed to help clients and ecosystem partners build IoT solutions.
Teledyne LeCroy introduces the QPHY-USB3.1-Tx-Rx package for automated USB 3.1 transmitter (Tx) and receiver (Rx) compliance testing, characterization, and debug, creating a unique and comprehensive USB 3.1 test suite. With the new test package, USB 3.1 testing can be performed on both Gen1 (5 Gb/s) and Gen2 (10 Gb/s) devices under test according to the latest USB 3.1 specifications.
Dow-Key® Microwave Corp., the world’s largest manufacturer of electromechanical switches, announced that it will be exhibiting at the 2015 NAB Show, booth SU6324, in Las Vegas, Nev. on April 13-16 at the Las Vegas Convention Center.