Cirexx International announced that they will be presenting their ECLIPS technology at IMS2015 in Phoenix, Ariz., May 17-22. Cirexx will be in Booth # 2023. ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF/microwave printed circuit boards (PCBs) employing an embedded low-CTE, thermally engineered metalized heat-sink layer which has superior thermal conductivity characteristics.
Transline Technology Inc. announced that they will be hosting a booth at the IMS tradeshow, May 19-21, 2015, at the Phoenix Convention Center in Ariz. Transline Technology is a printed circuit board (PCB) manufacturer, based in Anaheim, Calif., which specializes in RF and Microwave applications. TTi has been in business for over 20 years. This will be the sixth year Transline has been an exhibitor at IMS, and considers this tradeshow to be their most important of the year.
Rogers Corp., a global leader in engineered materials solutions, announced it has signed a definitive agreement to acquire Arlon, LLC, currently owned by Handy & Harman Ltd., for $157 million, subject to closing and post-closing adjustments. The transaction, which is subject to regulatory clearances, is expected to close in the first half of 2015.
Mentor Graphics Corp., released the Xpedition Systems Designer for multi-board systems connectivity. The product captures the hardware description of multi-board systems, from logical system definition to individual PCBs and automates multi-level system design synchronization processes.
Altium Ltd., a global leader in electronic design automation, native 3D PCB design systems (Altium Designer) and embedded software development toolkits (TASKING), announced the upcoming release of its professional printed circuit board (PCB) and electronic system level design software, Altium Designer 15.
Isola Group S.à r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), announced that Advanced Circuits Inc. Tempe division (ACI) has successfully completed Isola’s Certification Program.
Isola Group S.à r.l., a market leader in dielectric materials used to fabricate advanced multilayer printed circuit boards, announced that GETEK® laminates and prepegs are now in production at its facility in Düren, Germany, which will shorten lead times to Isola’s European customers. GETEK materials provide the low-dielectric constant and low-dissipation factors demanded by high-speed, low-loss printed circuit board designs and applications, while providing superior thermal performance and high reliability based on the system’s 180°C glass transition temperature (Tg).
Ohmega Technologies has introduced OhmegaPly® MTR™ Technology, which allows thin film resistors to be built within a printed circuit trace that is less than 100 microns (0.004”) wide. Using standard subtractive printed circuit board processes, it is ideal for high density interconnect (HDI) designs where passive component placement is difficult or impossible.
DuPont Microcircuit Materials (MCM) is introducing a new series of screen printed conductive ink materials for the printed electronics market, designed to offset the rising cost of silver. Utilizing proprietary technology and under typical processing conditions used for many printed electronic applications, DuPont PE8XX series conductive inks can provide low resistivity with 20 percent or more potential cost savings for manufacturers.