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Articles Tagged with ''module''

Infineon presents world’s smallest plug-and-play NFC security module for smart wearables

From fitness trackers and smart keys to chains, watches or wristbands – wearable manufacturers are challenged to equip even the smallest of devices with security and NFC technologies. The solution lies in a unique NFC security module series launched by Infineon Technologies AG in collaboration with Beijing-based Mobile Payment Solutions Co. Ltd. (MPS).


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Empower RF Systems and TEVET announce partnership

Empower RF Systems announced a partnership with TEVET to become a value added reseller of Empower’s RF and microwave amplifier modules and systems. TEVET is an established nationally recognized technology driven Service-Disabled Veteran-Owned and HUBZone Small Business (SDVOSB) with exemplary performance servicing the aerospace, defense and energy markets.


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Skyworks expands suite of SkyLiTE Solutions

Skyworks Solutions Inc., an innovator of high performance analog semiconductors connecting people, places and things, today announced it has expanded its family of SkyLiTE™ front-end solutions powering LTE devices. Originally targeted for mobile platforms in emerging markets, the newest solutions are also being adopted across Internet of Things (IoT) applications that utilize embedded cellular connections such as the connected car and wearables.


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Microsemi’s new RF module speeds time-to-market for implantable medical device designers

Microsemi Corp., a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, announced the availability of the smallest radio module it has ever produced. The ZL70323 is optimized for implantable medical devices such as pacemakers, cardiac defibrillators and neurostimulators—measuring just 5.5 x 4.5 x 1.5 mm.  


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TE Connectivity introduces lightweight Fortis Zd LRM connector system

TE Connectivity (TE), a world leader in connectivity, announces its new Fortis Zd LRM connector system, an innovative modular connector system for rugged, next-generation packaging from avionics boxes to military ground vehicles. It features a rugged, lightweight multi-bay shell that accepts high-speed digital signal, power, radio-frequency (RF) and optical modules.


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