From fitness trackers and smart keys to chains, watches or wristbands – wearable manufacturers are challenged to equip even the smallest of devices with security and NFC technologies. The solution lies in a unique NFC security module series launched by Infineon Technologies AG in collaboration with Beijing-based Mobile Payment Solutions Co. Ltd. (MPS).
Empower RF Systems announced a partnership with TEVET to become a value added reseller of Empower’s RF and microwave amplifier modules and systems. TEVET is an established nationally recognized technology driven Service-Disabled Veteran-Owned and HUBZone Small Business (SDVOSB) with exemplary performance servicing the aerospace, defense and energy markets.
Skyworks Solutions Inc., an innovator of high performance analog semiconductors connecting people, places and things, today announced it has expanded its family of SkyLiTE™ front-end solutions powering LTE devices. Originally targeted for mobile platforms in emerging markets, the newest solutions are also being adopted across Internet of Things (IoT) applications that utilize embedded cellular connections such as the connected car and wearables.
NuWaves Engineering, a veteran-owned small business delivering advanced radio frequency (RF) and microwave solutions, today introduced the NuPower 05E05A, a compact and highly efficient solid-state power amplifier (PA) module for S-Band transmitters and data links.
Qorvo™ Inc., a leading provider of core technologies and RF solutions for mobile, infrastructure and aerospace/defense applications,announced a series of innovations intended to accelerate the deployment of high-speed cable TV (CATV) DOCSIS 3.1 networks while providing cable designers greater flexibility in product design.
Microsemi Corp., a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, announced the availability of the smallest radio module it has ever produced. The ZL70323 is optimized for implantable medical devices such as pacemakers, cardiac defibrillators and neurostimulators—measuring just 5.5 x 4.5 x 1.5 mm.
Silicon Labs unveiled a dual-mode Bluetooth® Smart Ready module solution that gives embedded developers unparalleled flexibility to integrate both Bluetooth Smart and Bluetooth Basic Rate/Enhanced Data Rate (BR/EDR) wireless technologies while minimizing design time, cost and complexity.
TE Connectivity (TE), a world leader in connectivity, announces its new Fortis Zd LRM connector system, an innovative modular connector system for rugged, next-generation packaging from avionics boxes to military ground vehicles. It features a rugged, lightweight multi-bay shell that accepts high-speed digital signal, power, radio-frequency (RF) and optical modules.
M/A-COM Technology Solutions Holdings Inc. (“MACOM”), a leading supplier of high performance RF, microwave, millimeterwave and photonic semiconductor products, announced a GaN bias controller and sequencer for fixed and pulsed negative gate biasing.