Ted Rappaport, founding director of NYU WIRELESS and a leading proponent of using the millimeter wave spectrum for wireless communications, discusses the FCC's recent rulemaking actions and technology developments that are paving the way to 5G.
Accel-RF Instruments will showcases the world’s only line of fully integrated, modular platform, plug-and-play, completely automated accelerated life test systems at EDI CON USA, taking place September 20-22 in Boston, Mass.
The Altair Partner Alliance(APA) added systems engineering software from XLDyn, LLC to its lineup of software partnerships. The software is made up of two modules, XLSE and XL1D, which work together to automate the creation of system models and perform one dimensional (1D) multi-physics simulations.
Keysight Technologies Inc. announced a Gen 3 PXIe chassis and set of Gen 3 system components designed for complex, high-performance applications. Doubling the system bandwidth, the new products improve data streaming for capture/playback applications, such as 5G and electronic warfare. The Gen 3 products also provide a superior platform for large multi-channel and multi-chassis PXIe test systems for applications, such as MIMO and PA/FEM.
Harris Corp. has received an eight-year, $96 million ceiling, single-award IDIQ contract from the U.S. Naval Air Systems Command (NAVAIR) to supply precision approach radars (PAR) to the U.S. Navy, Air Force and Army. The contract was awarded during the fourth quarter of Harris' fiscal 2016.
Comtech Telecommunications Corp. announced that during its fourth quarter of fiscal 2016, its subsidiary, Comtech Systems Inc., received an order from a foreign prime contractor for approximately $7 million to design and install a number of fixed troposcatter terminals. The systems will be used by a foreign military end-customer for communications between off-shore islands.
Molex, a leading global manufacturer of electronic solutions, announced the acquisition of Interconnect Systems Inc. which specializes in the design and manufacture of high density silicon packaging with advanced interconnect technologies.