Articles Tagged with ''circuit''

A new white paper from AWR, “RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design,” examines a gallium arsenide (GaAs) pseudomorphic high electron mobility transistor (PHEMT) power amplifier (PA) design approach from a systems perspective.

Vishay Intertechnology Inc. announced that it has enhanced its ACAS 0612 precision thin film chip resistor arrays with tighter absolute TCR down to ± 10 ppm/K, relative TCR down to ± 5 ppm/K, and relative tolerance down to ± 0.05 % for automotive, industrial, and telecommunications applications. 

Expanding on its full suite of RF Inductor design tools, Coilcraft has added an updated ADS Component Library to its selection of online 2D/3D, S-Parameter and SPICE Models. Coilcraft’s Component Library includes models of its RF and Spring inductors and integrates with Agilent's Advanced Design System (ADS), helping engineers accurately simulate the performance of Coilcraft inductors in their circuit designs.

DuPont Circuit & Packaging Materials (DuPont) and IQLP LLC, a division of Interplex Industries Inc., announced their ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications.  The development efforts are being conducted pursuant to a joint development agreement and a license agreement previously entered into by the parties.

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multi-layer Printed Circuit Boards (PCBs), announced Astra™, the company’s breakthrough very low-loss dielectric constant (Dk) product for millimeter wave frequencies and beyond.

AWR announces the dates and venues for its AWR Design Forum 2013 (ADF2013) events in China and Taiwan that take place in early September. The AWR Design Forum is an open event at which designers of microwave and RF circuits and systems can network, share useful information, and collaborate on industry issues and trends. 

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multi-layer Printed Circuit Boards (PCBs), announced its new low loss, low skew, high-speed material, GigaSync™. This product has been engineered to eliminate skew issues in high-speed designs that use differential pairs to create a balanced transmission system able to carry differential (equal and opposite) signals across a printed circuit board. 

A new application note from AWR highlights the use of AWR’s Microwave Office® circuit design software to develop a Q- to E-Band doubler and a K- to E-Band quadrupler circuit (including a medium E-Band power amplifier) for millimeter-wave wireless systems. The design effort resulted in an increase in gain as well as output power, two critical criteria for E-Band systems.

PCB prototyping specialist LPKF Laser & Electronics has announced an interactive website feature that helps those interested in in-house PCB prototyping learn which equipment would best fit their electrical engineering applications.

ALCIOM, a consulting and design company specializing in innovative mixed-signal projects, used AWR’s Visual System Simulator™ (VSS) system design software and Microwave Office® circuit design software to develop a wideband RF downconverter subsystem for a custom measurement instrument with strict instrumentation-grade specifications.