Articles Tagged with ''circuit''

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Tech-X Corp. of Boulder, CO announced the release of Vorpal 6.0. New in the release is the customization of Vorpal for targeted industries. With the VSimEM package for electrostatic and electromagnetic problems, VSimMD for the microwave device optimization, VSimPA for plasma acceleration simulations, VSimPD for plasma discharge simulations, VSimBase for the educational market, and VSimPro, which provides the full features of Vorpal, the pricing and use of Vorpal is more flexible and more focused on meeting the needs of customers.

Ohmega Technologies has introduced OhmegaPly® MTR™ Technology, which allows thin film resistors to be built within a printed circuit trace that is less than 100 microns (0.004”) wide. Using standard subtractive printed circuit board processes, it is ideal for high density interconnect (HDI) designs where passive component placement is difficult or impossible.

AWR Corp. has announced AWR Design Environment V10.04, its first new software release in 2013, which includes many new features and enhancements to Microwave Office/Analog Office and Visual System Simulator, as well as AXIEM and Analyst.

CST is pleased to announce that the Optenni Lab™ matching circuit optimization software is now available through the global CST sales channels. Optenni Lab will be fully supported by the CST sales and technical support teams distributors worldwide.

Optenni Ltd has signed worldwide distribution agreements for the Optenni Lab matching circuit optimization software with both Computer Simulation Technology AG (CST) and EM Software & Systems-S.A. (Pty) Ltd (EMSS).

Coaxicom’s innovative 1 W 3900X series terminations are designed to minimize reflected power that often impedes transmission quality. Used across a spectrum of multi-port microwave devices including directional couplers, isolators and high-power transmitter applications, terminations absorb energy and prevent RF signals from reflecting back from open-ended or unused circuit ports.

Rogers Corp., a leading supplier of high frequency laminate materials for circuit boards in amplifiers, antennas, switches, and microwave radios, will highlight several of its high-quality printed circuit board (PCB) materials at the upcoming IPC APEX EXPO® Conference & Exhibition.

Rogers Corp., a supplier of high frequency laminate materials for circuit boards in amplifiers, antennas, switches, and microwave radios, will highlight several of its high-quality printed circuit board (PCB) materials at the upcoming IPC APEX EXPO® Conference & Exhibition.

AWR has just published a new Microwave Office® software application note titled, “End-to-end Design and Realization of an X-band Transmission Analyzer Using AWR Circuit, System, and EM Software.” The note examines the complete flow and details the design of several critical design elements for this device, which integrates many RF components on a single printed circuit board (PCB).

AWR's new application note, “Using Analyst™ To Quickly And Accurately Optimize A Chip-Module-Board Transition,” highlights the unique features of its’s 3D finite element method (FEM) EM simulator by demonstrating the optimization of the transition from a board-to-chip signal path.