Articles Tagged with ''circuit''

Rogers Corp. will be at PCB West, one of the electronic industry’s major technical events, on September 16, 2015 at the Santa Clara Convention Center (Santa Clara, CA). Rogers will provide examples of its high-performance printed-circuit-board (PCB) materials and participate in the technical symposium with a talk on how to perform wideband testing of PCBs with plated finishes. 

Amphenol Invotec Ltd. has gained approval from Underwriters Laboratories for I-Tera®MT; a very low loss laminate, developed for high speed applications. I-Tera®MT laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.

Anokiwave Inc., an innovative provider of highly integrated core IC solutions for mmWave and AESA markets,  announced the latest addition to its leadership team with the appointment of Carl Frank to the position of vice president of business development. This appointment comes at a time of strategic expansion for Anokiwave.

 Remcom announces a new circuit element optimizer for XFdtd® electromagnetic simulations software that optimizes matching circuits for several antennas serving multiple bands simultaneously. XFdtd’s Circuit Element Optimizer determines lumped element values based on the following goals: radiation efficiency, system efficiency, and S-parameters. This simplifies the antenna matching workflow because the circuit elements remain in the electromagnetic layout structure during optimization. 

Rogers Corp., a global technology leader in the development of high performance printed circuit materials, announced that its division previously known as Advanced Circuit Materials is changing its name to Advanced Connectivity Solutions (ACS)

Cirexx International announced that they will be presenting their ECLIPS technology at IMS2015 in Phoenix, Ariz., May 17-22. Cirexx will be in Booth # 2023. ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF/microwave printed circuit boards (PCBs) employing an embedded low-CTE, thermally engineered metalized heat-sink layer which has superior thermal conductivity characteristics.

Transline Technology Inc. announced  that they will be hosting a booth at the IMS tradeshow, May 19-21, 2015, at the Phoenix Convention Center in Ariz. Transline Technology is a printed circuit board (PCB) manufacturer, based in Anaheim, Calif., which specializes in RF and Microwave applications. TTi has been in business for over 20 years. This will be the sixth year Transline has been an exhibitor at IMS, and considers this tradeshow to be their most important of the year.

Attendees of the 2015 International Microwave Symposium (IEEE-IMS) Exhibition will have the opportunity to see printed circuit boards made in-person by visiting LPKF Laser & Electronics in Booth #2218. LPKF will be bringing back the versatile milling/laser hybrid Rapid Prototyping system, the ProtoMat D104.

Rogers Corp. unveiled its ULTRALAM® 3850HT liquid-crystal-polymer (LCP) laminates for simplified and improved construction of multilayer circuit boards at higher temperatures. With a melt temperature of +330°C, ULTRALAM 3850HT circuit materials are adhesiveless laminates that use LCP as the dielectric film to deliver high yields in single-layer and multilayer circuit constructions. These laminates are well suited for high-speed and high-frequency circuit applications.