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Articles Tagged with ''circuit''

UTAC and AT&S collaborate on turnkey supply for 3D SiP solutions

UTAC Holdings Ltd. (UTAC), one of the leading semiconductor assembly and test services provider in Asia, announced a joint collaboration with AT&S, one of the global leading manufacturers of high-end printed circuit boards (PCBs) with headquarters in Leoben, Austria, to provide complete turnkey supply chain solutions for three-dimensional system-in-package (“3D SiP”) requirements.


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Debut of latest LPKF laser system at International Microwave Week in San Francisco

Attendees of the 2016 International Microwave Symposium (IEEE-IMS) Exhibition will have the opportunity to see printed circuit boards made in-person by visiting LPKF Laser & Electronics in booth #1423. LPKF will be presenting its latest laser PCB prototyping system, the LPKF ProtoLaser S4, for the first time in North America.


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MACOM announces industry’s first CWDM4 L-PIC for 100G datacenter applications

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high-performance RF, microwave, millimeterwave and photonic semiconductor products, announced the MAOP-L284CN, a silicon photonic integrated circuit integrated with lasers (L-PIC™) for a 100G transmit solution for CWDM4 and CLR4 applications.


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Rogers Corp. to showcase advanced connectivity material solutions at IPC APEX EXPO 2016

Rogers Corp. will be exhibiting at the upcoming IPC APEX Expo scheduled for March 15-17 at the Las Vegas Convention Center, Las Vegas, Nev. Representatives from Rogers Corp. will be exhibiting at Booth #607, providing information and insight on the use of their circuit materials, including ULTRALAM® 3850HT, CLTE-XT™, TC350™ RO3003™ and XT/duroid® laminates. Rogers will also be previewing its new material system developed for extremely low loss digital applications.


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Isola names Jeff Waters president and CEO

Former Altera executive to lead global dielectric material manufacturer

Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), announced  that its board of directors has appointed Jeff Waters as president and CEO, effective immediately. Waters succeeds Interim CEO Jeffery McCreary, who was brought in to enable leadership continuity after Ray Sharpe’s retirement in August 2015.


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Rogers Corp. to exhibit and educate at DesignCon 2016

Rogers Corp. will be exhibiting and educating at the upcoming DesignCon show. Now in its 21st year, DesignCon is a premiere event for design chip-circuit-and system-level engineers working on high-frequency analog and high-speed digital circuits. DesignCon 2016 is scheduled for January 19-21, 2016 (January 20-21 for the exhibition) at the Santa Clara Convention Center in Santa Clara, Calif.


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New near-field probe with high resolution up to 10 GHz from Langer EMV-Technik

The SX probe heads' high measurement resolution allows the developer to pinpoint RF sources of between 1 and 10 GHz on densely packed printed circuit boards or on IC pins. The handy compact pin shape of the EMC near-field probes from Langer EMV-Technik GmbH provides the developer with convenient working conditions on the respective PCB.


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