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Articles Tagged with ''circuit''

Remcom announces unique technology for optimizing matching circuit elements

 Remcom announces a new circuit element optimizer for XFdtd® electromagnetic simulations software that optimizes matching circuits for several antennas serving multiple bands simultaneously. XFdtd’s Circuit Element Optimizer determines lumped element values based on the following goals: radiation efficiency, system efficiency, and S-parameters. This simplifies the antenna matching workflow because the circuit elements remain in the electromagnetic layout structure during optimization. 


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Cirexx to present ECLIPS technology at IMS2015

Cirexx International announced that they will be presenting their ECLIPS technology at IMS2015 in Phoenix, Ariz., May 17-22. Cirexx will be in Booth # 2023. ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF/microwave printed circuit boards (PCBs) employing an embedded low-CTE, thermally engineered metalized heat-sink layer which has superior thermal conductivity characteristics.


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Transline Technology to exhibit at IMS2015 in Phoenix

Transline Technology Inc. announced  that they will be hosting a booth at the IMS tradeshow, May 19-21, 2015, at the Phoenix Convention Center in Ariz. Transline Technology is a printed circuit board (PCB) manufacturer, based in Anaheim, Calif., which specializes in RF and Microwave applications. TTi has been in business for over 20 years. This will be the sixth year Transline has been an exhibitor at IMS, and considers this tradeshow to be their most important of the year.


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Liquid-Crystal-Polymer Laminates: ULTRALAM 3850HT

Rogers Corp. unveiled its ULTRALAM® 3850HT liquid-crystal-polymer (LCP) laminates for simplified and improved construction of multilayer circuit boards at higher temperatures. With a melt temperature of +330°C, ULTRALAM 3850HT circuit materials are adhesiveless laminates that use LCP as the dielectric film to deliver high yields in single-layer and multilayer circuit constructions. These laminates are well suited for high-speed and high-frequency circuit applications.


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