T-Tech Inc. the manufacturer of the Quick Circuit rapid prototyping system announces CNC2PCB®. The new software application allows you to output your DXF data, Gerber data, or NC Drill data to computer numerical control programs. By following the EIA RS-274 industry standard, the output from CNC2PCB allows you to fabricate your PCB or chassis on your milling center in your mechanical engineering department.
Modelithics Inc. and IPDiA, have teamed up to develop Modelithics models for IPDiA’s high performance ultra broadband surface mount silicon capacitor. Modelithics and IPDiA worked closely as part of the Modelithics Vendor Partner (MVP) Program to characterize the 10 nF low profile (100 µm) capacitor (UBSC 935 152 492 510).
MaxLinear Inc., a leading provider of RF and mixed-signal integrated circuits for cable and satellite broadband communications, the connected home, data center, metro, long-haul fiber networks and wireless infrastructure, announced the MxL3710, the world’s first fully integrated circuit (IC) to support the multi-gigabit Multimedia over Coax Alliance (MoCA®) 2.5 standard that provides at least 2.5Gbps of aggregate MAC throughput.
Rogers Corp. introduces RO4730G3™ UL 94 V-0 antenna-grade laminates to meet present and future performance requirements in active antenna arrays and small cells, notably in 4G base transceiver stations (BTS) and Internet of Things (IoT) applications as well as emerging 5G wireless systems.
Modelithics Inc. and Coilcraft Inc. have teamed to develop two new Microwave Global Models™ for the Coilcraft BCL and BCR RF and microwave inductor families. Modelithics Microwave Global Models are high-accuracy equivalent circuit models that cover an entire component series within a single model.
UTAC Holdings Ltd. (UTAC), one of the leading semiconductor assembly and test services provider in Asia, announced a joint collaboration with AT&S, one of the global leading manufacturers of high-end printed circuit boards (PCBs) with headquarters in Leoben, Austria, to provide complete turnkey supply chain solutions for three-dimensional system-in-package (“3D SiP”) requirements.
Attendees of the 2016 International Microwave Symposium (IEEE-IMS) Exhibition will have the opportunity to see printed circuit boards made in-person by visiting LPKF Laser & Electronics in booth #1423. LPKF will be presenting its latest laser PCB prototyping system, the LPKF ProtoLaser S4, for the first time in North America.
M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high-performance RF, microwave, millimeterwave and photonic semiconductor products, announced the MAOP-L284CN, a silicon photonic integrated circuit integrated with lasers (L-PIC™) for a 100G transmit solution for CWDM4 and CLR4 applications.
Rogers Corp. will be exhibiting at the upcoming IPC APEX Expo scheduled for March 15-17 at the Las Vegas Convention Center, Las Vegas, Nev. Representatives from Rogers Corp. will be exhibiting at Booth #607, providing information and insight on the use of their circuit materials, including ULTRALAM® 3850HT, CLTE-XT™, TC350™ RO3003™ and XT/duroid® laminates. Rogers will also be previewing its new material system developed for extremely low loss digital applications.