What: AWR is a gold sponsor at the Electronic Design Innovations Conference (EDI CON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, VSS™ system design software, as well as AXIEM® 3D planar EM software and Analyst™ 3D FEM EM software.
Aeroflex/Inmet Inc. and Modelithics Inc. have teamed to develop Global™ Models for Aeroflex/ Inmet surface mount attenuators (PCAF and PCAAF series) and high power chip resistors (NPC50-50W and NPC50-100W series). The advanced model features include substrate scaling, pad geometry scaling and part value selectability.
AWR's new application note, “Using Analyst™ To Quickly And Accurately Optimize A Chip-Module-Board Transition,” highlights the unique features of its’s 3D finite element method (FEM) EM simulator by demonstrating the optimization of the transition from a board-to-chip signal path.
AWR has just published a new Microwave Office® software application note titled, “End-to-end Design and Realization of an X-band Transmission Analyzer Using AWR Circuit, System, and EM Software.” The note examines the complete flow and details the design of several critical design elements for this device, which integrates many RF components on a single printed circuit board (PCB).
Rogers Corp., a supplier of high frequency laminate materials for circuit boards in amplifiers, antennas, switches, and microwave radios, will highlight several of its high-quality printed circuit board (PCB) materials at the upcoming IPC APEX EXPO® Conference & Exhibition.
Rogers Corp., a leading supplier of high frequency laminate materials for circuit boards in amplifiers, antennas, switches, and microwave radios, will highlight several of its high-quality printed circuit board (PCB) materials at the upcoming IPC APEX EXPO® Conference & Exhibition.
Coaxicom’s innovative 1 W 3900X series terminations are designed to minimize reflected power that often impedes transmission quality. Used across a spectrum of multi-port microwave devices including directional couplers, isolators and high-power transmitter applications, terminations absorb energy and prevent RF signals from reflecting back from open-ended or unused circuit ports.
Optenni Ltd has signed worldwide distribution agreements for the Optenni Lab matching circuit optimization software with both Computer Simulation Technology AG (CST) and EM Software & Systems-S.A. (Pty) Ltd (EMSS).
CST is pleased to announce that the Optenni Lab™ matching circuit optimization software is now available through the global CST sales channels. Optenni Lab will be fully supported by the CST sales and technical support teams distributors worldwide.