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Articles Tagged with ''circuit''

Plextek reveals low cost amplifier integrated circuit at IMS2012

Plextek (www.plextek.com), a leading designer of custom ICs operating at microwave and mm-wave frequencies, will be presenting details of a low cost, SMT packaged, 6 to 18GHz, 0.5W amplifier integrated circuit (IC) at the International Microwave Symposium, the world’s largest microwave conference and exhibition.


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AWR highlights software demos at IMS 2012

Visit AWR at the Booth #1514 to see Analyst™ - 3D EM technology for bumps, bond wires, tapered vias and more - and the latest release of Microwave Office™, Visual System Simulator™, AXIEM® and Analog Office® for MMIC, RFIC, RF PCB and module design.


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AWR Design Forum adds Taiwan to 2012 schedule

AWR Corp. announces that it has added Taiwan to the list of cities scheduled for the July 2012 tour of the AWR Design Forum (ADF) 2012. The Taiwan event will take place on Thursday, July 12. 


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Rogers to introduce new circuit material solutions at IMS 2012

Rogers Corp. and representatives of its Advanced Circuit Materials Division will be at the upcoming 2012 IEEE International Microwave Symposium (IMS) to help attendees learn more about Rogers’ wide range of high frequency circuit materials.


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AWR announces Design Forum 2012

AWR Corp. announces the AWR Design Forum (ADF) 2012 for Japan and Korea. The Japan event is scheduled for Friday, July 6, 2012 and the Korea event is scheduled for Tuesday, July 10, 2012. The call for papers for both events is now open. Visit www.awrdesignforum.com to learn more and to submit a presentation.


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Teledyne Relays announces high power DC solid state relays

Teledyne Relays has added a range of Power DC Solid State Relays with load voltage ratings from 42V to 1700V, with load currents ranging from 5A to 150A to its Solid-State Power Relays catalogue.


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EMSS and Optenni announce workflow between FEKO and Optenni

EDAFocus

FEKOMatching circuits for antennas and other RF components based on 3D models can now be easily optimized by designers who use FEKO together with Optenni Lab.


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Agilent latest Genesys software enhances RF system design

EDAFocus

Genesys 2012Agilent Technologies Inc. announced the latest release of its low-cost, high-performance software for RF and microwave board design, Genesys 2012.


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AWR expands patent portfolio

PCB ViasAWR Corp., a leader in high-frequency EDA software, has been issued a US Patent by the United States Patent and Trademark Office for “automatic creation of vias in electrical circuit design.”


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Teardown: Samsung cuts LTE cost in half

The Samsung Galaxy Nexus made a big impact on the market in December due to its sleek design, new Android operating system (Ice Cream Sandwich) and NFC capability.
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