Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards, announced that it has enhanced its Quick Turnaround (QTA) Service in the U.S. to support its customers’ Just-in-Time (JIT) inventory strategies and QTA programs.
Analog Devices Inc. introduced the CN0267 demonstration circuit for a loop powered HART® (Highway Addressable Remote Transducer) enabled smart transmitter, for industrial applications that need to operate within a set 3.5-mA power budget. This field instrument circuit demonstrates a complete low power, high precision signal chain solution with minimum area overhead, which has been tested and verified by ADI as part of their Circuits from the Lab™ reference circuits’ initiative.
MathWorks announced strengthened support for wireless communications and radar design with MATLAB and Simulink. Release 2013a now allow designers to speed up modeling and simulation within the familiar MATLAB and Simulink environments.
Auriga Microwave, an innovator in the design of high-powered RF and microwave devices, announces that the U.S. Patent and Trademark Office granted a patent for technology that will make the control circuit design much simpler for high-power RF switches used in many communication systems.
Piconics Inc. and Modelithics Inc. have collaborated to upgrade the previous Piconics conical inductor S-parameter models to full equivalent circuit models, now offering substrate scalability/selectability, series and shunt configurations, and broadband validation up to as high as 65 GHz for some configurations. These models represent the first comprehensive, measurement-based equivalent circuit models for conical inductors in the Modelithics Library.
VidaRF offers low cost Drop-In, 1”x1” Circulators & Isolators designed for various wireless and power amplifier applications. The robust design provides high performance and reliability, typ specs: VSWR 1.13/Loss 0.25dB/ISOL 23dB, great IMD, and is magnetically shielded. Circuit tab can be straight or bent flush with base for surface mounting.
What: AWR is a gold sponsor at the Electronic Design Innovations Conference (EDI CON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, VSS™ system design software, as well as AXIEM® 3D planar EM software and Analyst™ 3D FEM EM software.
Aeroflex/Inmet Inc. and Modelithics Inc. have teamed to develop Global™ Models for Aeroflex/ Inmet surface mount attenuators (PCAF and PCAAF series) and high power chip resistors (NPC50-50W and NPC50-100W series). The advanced model features include substrate scaling, pad geometry scaling and part value selectability.
AWR's new application note, “Using Analyst™ To Quickly And Accurately Optimize A Chip-Module-Board Transition,” highlights the unique features of its’s 3D finite element method (FEM) EM simulator by demonstrating the optimization of the transition from a board-to-chip signal path.