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Articles Tagged with ''circuit''

Rogers to highlight material solutions spanning RF to digital at the 2012 IPC Midwest Show

Rogers Corp.
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Rogers Corp. will have a strong presence at the upcoming IPC Midwest Exhibition and Conference, both on the show floor and as part of the technical conference. This key industry event is scheduled for August 22-23 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL, the IPC Midwest Exhibition and Conference (www.ipcmidwestshow.org) is for electronic circuit assembly and printed-circuit-board (PCB) manufacturing professionals.


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AWR Design Forum 2012 fall European tour announced

EDAFocus
AWR Corp.
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AWR Design Forum Europe 2012AWR Corp. announces its European phase of its ADF 2012 tour, an open event for designers of microwave and RF circuits and systems such as MMIC, RFIC, RF PCB, modules, and communication systems.


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AWR Design Forum 2012 agendas and registration announced

AWR Corp.
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AWR Corp. announced that agendas for the AWR Design Forums (ADF) 2012 (www.awrdesignforum.com) for Japan, Korea and Taiwan have been finalized and posted online, and registration will be open through the day preceding each event.


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A Center-Tapped CRLH ZOR UWB Bandpass Filter with Improved Stopband

Sungtek Kahng and Dongjin Lim, University of Incheon, Incheon, Korea
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Features a center-tapped ZOR UWB BPF with improved stopband by being cascaded with a compact bandstop filter


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Agilent's newest 3D-EM software release increases integration with circuit design flow

Agilent Technologies Inc., Santa Clara, CA
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Plextek reveals low cost amplifier integrated circuit at IMS2012

Plextek
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Plextek (www.plextek.com), a leading designer of custom ICs operating at microwave and mm-wave frequencies, will be presenting details of a low cost, SMT packaged, 6 to 18GHz, 0.5W amplifier integrated circuit (IC) at the International Microwave Symposium, the world’s largest microwave conference and exhibition.


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AWR highlights software demos at IMS 2012

AWR Corp.
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Visit AWR at the Booth #1514 to see Analyst™ - 3D EM technology for bumps, bond wires, tapered vias and more - and the latest release of Microwave Office™, Visual System Simulator™, AXIEM® and Analog Office® for MMIC, RFIC, RF PCB and module design.


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AWR Design Forum adds Taiwan to 2012 schedule

AWR Corp.
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AWR Corp. announces that it has added Taiwan to the list of cities scheduled for the July 2012 tour of the AWR Design Forum (ADF) 2012. The Taiwan event will take place on Thursday, July 12. 


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Rogers to introduce new circuit material solutions at IMS 2012

Rogers Corp.
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Rogers Corp. and representatives of its Advanced Circuit Materials Division will be at the upcoming 2012 IEEE International Microwave Symposium (IMS) to help attendees learn more about Rogers’ wide range of high frequency circuit materials.


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AWR announces Design Forum 2012

AWR Corp.
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AWR Corp. announces the AWR Design Forum (ADF) 2012 for Japan and Korea. The Japan event is scheduled for Friday, July 6, 2012 and the Korea event is scheduled for Tuesday, July 10, 2012. The call for papers for both events is now open. Visit www.awrdesignforum.com to learn more and to submit a presentation.


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