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Articles Tagged with ''circuit''

Ohmega Technologies introduces OhmegaPly MTR thin film resistor material

Ohmega Technologies has introduced OhmegaPly® MTR™ Technology, which allows thin film resistors to be built within a printed circuit trace that is less than 100 microns (0.004”) wide. Using standard subtractive printed circuit board processes, it is ideal for high density interconnect (HDI) designs where passive component placement is difficult or impossible.


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Tech-X Corp. releases Vorpal 6.0

Tech-X Corp. of Boulder, CO announced the release of Vorpal 6.0. New in the release is the customization of Vorpal for targeted industries. With the VSimEM package for electrostatic and electromagnetic problems, VSimMD for the microwave device optimization, VSimPA for plasma acceleration simulations, VSimPD for plasma discharge simulations, VSimBase for the educational market, and VSimPro, which provides the full features of Vorpal, the pricing and use of Vorpal is more flexible and more focused on meeting the needs of customers.


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Rogers to show high-performance laminates and bondply materials at electronica 2012

Rogers Corp. will be exhibiting several of its high-performance circuit materials at the upcoming electronica 2012 trade show. Scheduled for November 13-16, 2012 at the New Munich Trade Fair Centre, Munich, Germany, the 25th international electronica trade show (www.electronica.de) is a major electronics event for a wide range of business sectors, including automotive, medical, consumer, commercial, military and general wireless markets. The electronics trade show attracts press coverage from 22 countries and more than 500 technical publications.


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AWR Connected for Optenni Lab accelerates wireless antenna design

AWR Corp. and Optenni Ltd. announced AWR Connected for Optenni Lab, an integrated workflow that accelerates wireless antenna design by enabling optimized matching circuits to be transferred from Optenni Lab matching circuit software to AWR’s Microwave Office high-frequency design software with a single mouse click. The interface constructs the matching circuit in Microwave Office, sets up and runs the simulation, and then allows for further refinement and analysis within Microwave Office and AXIEM®, AWR’s 3D planar electromagnetic simulator.


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