- Buyers Guide
AWR Corp., a leader in high-frequency EDA software, has been issued a US Patent by the United States Patent and Trademark Office for “automatic creation of vias in electrical circuit design.”
Agilent Technologies Inc. announced the latest release of its low-cost, high-performance software for RF and microwave board design, Genesys 2012.
Matching circuits for antennas and other RF components based on 3D models can now be easily optimized by designers who use FEKO together with Optenni Lab.
Teledyne Relays has added a range of Power DC Solid State Relays with load voltage ratings from 42V to 1700V, with load currents ranging from 5A to 150A to its Solid-State Power Relays catalogue.
AWR Corp. announces the AWR Design Forum (ADF) 2012 for Japan and Korea. The Japan event is scheduled for Friday, July 6, 2012 and the Korea event is scheduled for Tuesday, July 10, 2012. The call for papers for both events is now open. Visit www.awrdesignforum.com to learn more and to submit a presentation.
Rogers Corp. and representatives of its Advanced Circuit Materials Division will be at the upcoming 2012 IEEE International Microwave Symposium (IMS) to help attendees learn more about Rogers’ wide range of high frequency circuit materials.
AWR Corp. announces that it has added Taiwan to the list of cities scheduled for the July 2012 tour of the AWR Design Forum (ADF) 2012. The Taiwan event will take place on Thursday, July 12.
Visit AWR at the Booth #1514 to see Analyst™ - 3D EM technology for bumps, bond wires, tapered vias and more - and the latest release of Microwave Office™, Visual System Simulator™, AXIEM® and Analog Office® for MMIC, RFIC, RF PCB and module design.
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