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Articles Tagged with ''modules''

RFMD unveils suite of products to enable entry Smartphone segment

RF Micro Devices Inc. announced the expansion of the company's entry solutions product portfolio to include multiple new solutions for 2G and 3G entry smartphones. The new RF solutions are designed to solve the increasingly complex RF requirements of entry-level 2G and 3G smartphones related to cost, band count, and thermal dissipation.


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Anaren and Emmoco partner to develop AIR support for BLE solution

Anaren Inc. announced that its Anaren Integrated Radio (AIR) module team is partnering with Austin, Texas-based middleware developer Emmoco to create the AIR Support for BLE solution. As a guest supplier at the Premier-Farnell booth (#220, Hall 5) in the Embedded World 2013 exhibition, the AIR team will be explaining its technology concept for fast-emerging Bluetooth Low Energy (BLE) applications -- and will also be actively developing a pool for "beta-testers" for the upcoming AIR Support for BLE solution, which is scheduled for release in the spring/summer of 2013.


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Pulse Electronics introduces pin-in-paste RF MoCA filter modules

Pulse Electronics Corp., a leading provider of electronic components, introduces RF MoCA (Multimedia over Cable Alliance) filter modules that are pin-in-paste compatible. Pin-in-paste manufacturing uses a reflow instead of a wave soldering process to apply solder to the components, saving time, increasing throughput, and reducing costs. These filters are compliant with MoCA 1.1 and 2.0 requirements and are qualified with leading MoCA silicon vendors.


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TE Connectivity announces new VITA 67 standards For RF connector modules

The VITA 67.0, 67.1 and 67.2 standards, which define the RF connector modules for implementation within the OpenVPX™ architecture, have been ratified by the American National Standards Institute (ANSI). TE Connectivity's (TE) RF connector modules, which meet these new standards, have been designed for high-reliability, high-density aerospace and defense applications that meet the vibration, environmental and corrosion resistance requirements of VITA 47.


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TI expands its Bluetooth wireless connectivity portfolio with QFN packages, module designs, new software

Texas Instruments Inc. (TI), leading the industry with the most complete wireless connectivity portfolio for embedded applications,today announced that its Bluetooth® v4.0 technology-based CC2560 and CC2564 wireless devices are now available in easy-to-integrate QFN packages offered by TI and its distribution partners. TI also announced the availability of additional production-ready modules based on the two devices, as well as software and tools.


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