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Articles Tagged with ''modules''

e2v introduces a new range of ultra-compact, ITAR-free microwave power modules

At DSEI 2013, e2v, the innovative solutions provider, will be introducing a new range of ultra wideband (2-18GHz) Microwave Power Modules (MPMs). Suitable for use in Electronic Warfare (EW), data links and radar and communications systems, the MPMs feature market-leading size, weight and power (SWaP) characteristics and are not covered by International Traffic in Arms Regulations (ITAR).


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DP1203 Series radio-only transceiver from Linx allows effective customization to optimize RF

Linx Technologies' new DP1203 Series radio-only RF transceiver module is designed for the wireless transmission of digital data at data rates of up to 152.3 kbps. Operating in the 433, 868 and 915 MHz license-free ISM (industrial scientific and medical) frequency bands, this module series is ideal for applications that require full-control of the radio channels and configuration, without having to go through the effort and expense of a discrete RF design.


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Laird Technologies to exhibit wireless solutions at CTIA 2013

Laird Technologies Inc., a global technology company, will exhibit solutions for the wirelessly connected world at CTIA 2013. Embedded wireless, active thermal management and telematics products will be on display, allowing Laird to showcase a range of wireless capabilities. The CTIA Conference and Exhibition will be held at the Sands Expo and Convention Center in Las Vegas, May 21-23. Laird will exhibit at booth #6136.  


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RFMD unveils suite of products to enable entry Smartphone segment

RF Micro Devices Inc. announced the expansion of the company's entry solutions product portfolio to include multiple new solutions for 2G and 3G entry smartphones. The new RF solutions are designed to solve the increasingly complex RF requirements of entry-level 2G and 3G smartphones related to cost, band count, and thermal dissipation.


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Anaren and Emmoco partner to develop AIR support for BLE solution

Anaren Inc. announced that its Anaren Integrated Radio (AIR) module team is partnering with Austin, Texas-based middleware developer Emmoco to create the AIR Support for BLE solution. As a guest supplier at the Premier-Farnell booth (#220, Hall 5) in the Embedded World 2013 exhibition, the AIR team will be explaining its technology concept for fast-emerging Bluetooth Low Energy (BLE) applications -- and will also be actively developing a pool for "beta-testers" for the upcoming AIR Support for BLE solution, which is scheduled for release in the spring/summer of 2013.


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