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Articles Tagged with ''modules''

Agilent introduces seven high-power modules for modular power system

January 23, 2012
Agilent Technologies Inc. introduced seven high-power modules for its popular N6700 modular power system.
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UHF narrow band telecommand modules available from LPRS

February 24, 2012

LPRS, Europe’s leading supplier of short-range radio devices announced the availability of the multi-channel telecommand transmitter and receiver modules. The new CDT-TX-02M-R and CDT-RX-02M-R modules offer long range control, low voltage operation with low current consumption for reliable battery operation and CDT-01-compatible communication format.


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RFMD introduces WiFi front end modules at IMS 2012

June 19, 2012

RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD's FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world's leading WiFi chipset providers.


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RFMD introduces WiFi front end modules at IMS 2012

June 25, 2012

RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD’s FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world’s leading WiFi chipset providers.


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RFMD delivers diversified revenue growth and margin expansion

July 25, 2012

RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, reported financial results for the Company's fiscal 2013 first quarter, ended June 30, 2012.


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Anaren integrated radio modules to be sold through RS

August 1, 2012

Anaren Inc. announced that it will be marketing its new family of Anaren Integrated Radio (AIR) modules with electronics distributor RS Components (RS), headquartered in Oxford, UK. The initiative is Anaren's first partnering opportunity with RS and is expected to provide AIR customers with a valuable new sourcing and support option.


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Curiosity lands on Mars with Crane Interpoint products

August 6, 2012

Crane Aerospace & Electronics congratulates National Aeronautics and Space Administration (NASA) on the successful landing of Curiosity on the Gale Crater, Mars, with InterpointTM dc-dc converter and EMI filter modules on board. Curiosity’s goal is not to find Martian life, but rather to seek out carbon-based organic compounds that are the building blocks of life, and then to determine whether the Gale Crater landing site was ever suitable for creatures. The Mars Science Laboratory (MSL) was launched from Cape Canaveral Air Force Station on November 26, 2011 via an Atlas V rocket.


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Cobham awarded $65 M contract for Boeing Wideband Global SATCOM satellite components

MarketWatch: Defense
August 10, 2012

Boeing satelliteCobham has been awarded a $65 million contract to supply electronic systems to Boeing’s Wideband Global SATCOM satellite program. The contract funds production on three satellite flight sets, with additional options for three more sets.


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TI expands its Bluetooth wireless connectivity portfolio with QFN packages, module designs, new software

October 25, 2012

Texas Instruments Inc. (TI), leading the industry with the most complete wireless connectivity portfolio for embedded applications,today announced that its Bluetooth® v4.0 technology-based CC2560 and CC2564 wireless devices are now available in easy-to-integrate QFN packages offered by TI and its distribution partners. TI also announced the availability of additional production-ready modules based on the two devices, as well as software and tools.


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TE Connectivity announces new VITA 67 standards For RF connector modules

November 29, 2012

The VITA 67.0, 67.1 and 67.2 standards, which define the RF connector modules for implementation within the OpenVPX™ architecture, have been ratified by the American National Standards Institute (ANSI). TE Connectivity's (TE) RF connector modules, which meet these new standards, have been designed for high-reliability, high-density aerospace and defense applications that meet the vibration, environmental and corrosion resistance requirements of VITA 47.


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