Articles Tagged with ''electronic''

Gain Block: TGA3504-SM

RFMW Ltd. announces design and sales support for the TGA3504-SM, 2 to 30GHz Gain Block from TriQuint (Qorvo). The TGA3504-SM offers 8 dBm of output P1 dB with a corresponding small signal gain of up to 11.5 dB. Output third order intercept is >17 dBm. Wideband performance of the TGA3504-SM supports multiple applications such as Electronic Warfare (EW), military and commercial radar and military or commercial communication systems.


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Mercury receives $3.6 M order for advanced RF products for EW application

Mercury Systems, Inc., a leading high-tech commercial provider of more affordable secure and sensor processing subsystems powering today’s critical defense and intelligence applications, announced it received a $3.6 million order from a leading defense prime contractor for advanced radio frequency (RF) products for a naval electronic warfare (EW) application.


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Cirexx presents ECLIPS at IMS 2014

Cirexx International is presenting the new ECLIPS technology this week at the International Microwave Symposium (IMS) at the Tampa Convention Center.  ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF and microwave Printed Circuit Boards (PCBs) employing an embedded low-CTE, thermally engineered metalized layer which has superior thermal conductivity characteristics.


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API Technologies wins strategic order for front end microwave system

API Technologies Corp., a leading provider of high performance RF/microwave, power, and security solutions for critical and high-reliability applications, announced  the receipt of a strategic development order for a multi-channel microwave front end system. This integrated microwave assembly (IMA) will be used in a next generation radar warning receiver targeted for use in major Department of Defense military aircraft platforms.


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Remtec develops new, cost-effective gold tin plating technique

Remtec Inc., the leading manufacturer of substrates and packages using plated copper on thick film (PCTF) metallization, has adapted its gold-tin plating technology on metallized ceramics to include a newly developed technique of selectively applying AuSn deposits for interconnecting RF and microwave electronic components, lead frames and other miniature parts on high frequency PC boards.


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