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Articles Tagged with ''characterization''

Agilent introduces enhanced solution for PCI Express 3.0 receiver characterization

Agilent Technologies Inc., Santa Clara, CA
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Agilent Technologies Inc. announced an enhanced solution for PCI Express® 3.0 receiver characterization at DesignCon.


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Agilent unveils new IC-CAP platform for device characterization and modeling

EDAFocus
Agilent Technologies Inc., Santa Clara, CA
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With IC-CAP 2013.01, Agilent introduces major improvements to its flagship product for high-frequency device modeling. One key improvement is turnkey extraction of the Angelov-GaN model, the industry standard compact device model for GaN semiconductor devices.


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EDI CON 2013 announces new participants

EDI CON
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EDI CON 2013 (March 12-14, Beijing, China), the industry-driven event for RF, microwave and high speed digital electronic design announces the recent addition of several leading RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers as participants in the technical program and exhibition. As solution providers in high frequency electronic design and system integration, experts from these companies will offer attendees the latest information on the technology used in today’s communications and aerospace industries.


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Lake Shore Cryotronics to speak on rugged THz photomixer package at IRMMW-THz

Lake Shore Cryotronics
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p> Lake Shore Cryotronics Inc., a manufacturer of scientific sensors, instruments, and systems for precise measurement and control, announces that it will be speaking about a rugged terahertz (THz) photomixer package specifically developed for cryogenic operation, at the International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz). The conference will be held Sept. 23-28, 2012, in Wollongong, Australia.


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