Articles Tagged with ''characterization''

Subscribe

EDI CON 2013 (March 12-14, Beijing, China), the industry-driven event for RF, microwave and high speed digital electronic design announces the recent addition of several leading RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers as participants in the technical program and exhibition. As solution providers in high frequency electronic design and system integration, experts from these companies will offer attendees the latest information on the technology used in today’s communications and aerospace industries.

With IC-CAP 2013.01, Agilent introduces major improvements to its flagship product for high-frequency device modeling. One key improvement is turnkey extraction of the Angelov-GaN model, the industry standard compact device model for GaN semiconductor devices.

Agilent Technologies Inc. announced an enhanced solution for PCI Express® 3.0 receiver characterization at DesignCon.

Keithley Instruments Inc. announces enhancements to its Automated Characterization Suite (ACS) software that support its expanding family of high power semiconductor characterization solutions. 

Lake Shore Cryotronics Inc. will attend the IEEE MTT International Microwave Symposium 2013 (IMS) in Seattle, WA June 2-7, where it will showcase its family of cryogenic and cryogen-free probe stations for characterizing the performance of early stage devices and materials. IMS is an international gathering of technologists involved in all aspects of microwave theory and practice, particularly those in RF, microwave, millimeter wave, and terahertz (THz) frequencies.