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Articles Tagged with ''characterization''

Anritsu introduces 110 GHz broadband VNA system

Test & Measurement
April 9, 2014

Anritsu Co. introduces the VectorStar™ ME7838E Vector Network Analyzer (VNA) broadband system that provides frequency coverage of 70 kHz to 110 GHz in a single connection. The ME7838E addresses the challenges associated with today’s high-speed device characterization.


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Averna RF Studio supports multi-recorder synchronization on PXI systems

Software/EDA
February 27, 2014

Averna announces a new software release for RF Studio, featuring the ability to synchronize four channels within 1 ns, among other enhancements.


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Lake Shore to discuss new 8500 Series THz system for material characterization at APS

February 21, 2014

Lake Shore Cryotronics, a leading innovator in solutions for measurement over a wide range of temperature and magnetic field conditions, announced that it will be discussing its soon-to-released terahertz (THz) system for materials characterization at the upcoming American Physical Society March Meeting in Denver.


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Agilent introduces series of BER test solutions for faster design verification

Test & Measurement
January 24, 2014

M8000seriesAgilent Technologies Inc. introduced the new M8000 Series BER test solution, a highly integrated and scalable bit error ratio test solution for physical-layer characterization, validation and compliance testing for receivers used in multigigabit digital designs. The new M8000 Series BER test solution provides accurate and reliable results that accelerate insight into the performance margins of high-speed digital devices.


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Auriga to showcase pulsed IV/RF characterization system and component test system at EuMW

October 1, 2013

Auriga Microwave is exhibiting at EuMW 2013, in booth #D104. On display will be Auriga's AU4850, a pulsed IV/RF characterization system, and its fourth generation component test system: CTS-4.


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Mesuro launches Rapid Load Pull test solution

May 31, 2013

Mesuro has launched a new test solution that utilizes an ‘envelope load pull technique’, along with the latest generation of commercial off-the-shelf PXI hardware and LabVIEW system design software from National Instruments.


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Lake Shore to highlight cryogenic probe stations and THz system at IMS 2013

May 17, 2013

Lake Shore Cryotronics Inc. will attend the IEEE MTT International Microwave Symposium 2013 (IMS) in Seattle, WA June 2-7, where it will showcase its family of cryogenic and cryogen-free probe stations for characterizing the performance of early stage devices and materials. IMS is an international gathering of technologists involved in all aspects of microwave theory and practice, particularly those in RF, microwave, millimeter wave, and terahertz (THz) frequencies.


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Keithley adds high power wafer-level testing to ACS software

Software/EDA
March 27, 2013

Keithley Instruments Inc. announces enhancements to its Automated Characterization Suite (ACS) software that support its expanding family of high power semiconductor characterization solutions. 


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Agilent introduces enhanced solution for PCI Express 3.0 receiver characterization

January 28, 2013

Agilent Technologies Inc. announced an enhanced solution for PCI Express® 3.0 receiver characterization at DesignCon.


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Agilent unveils new IC-CAP platform for device characterization and modeling

EDAFocus
December 20, 2012

With IC-CAP 2013.01, Agilent introduces major improvements to its flagship product for high-frequency device modeling. One key improvement is turnkey extraction of the Angelov-GaN model, the industry standard compact device model for GaN semiconductor devices.


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