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Articles Tagged with ''characterization''
Averna announces a new software release for RF Studio, featuring the ability to synchronize four channels within 1 ns, among other enhancements.
Lake Shore Cryotronics, a leading innovator in solutions for measurement over a wide range of temperature and magnetic field conditions, announced that it will be discussing its soon-to-released terahertz (THz) system for materials characterization at the upcoming American Physical Society March Meeting in Denver.
Agilent Technologies Inc. introduced the new M8000 Series BER test solution, a highly integrated and scalable bit error ratio test solution for physical-layer characterization, validation and compliance testing for receivers used in multigigabit digital designs. The new M8000 Series BER test solution provides accurate and reliable results that accelerate insight into the performance margins of high-speed digital devices.
Auriga Microwave is exhibiting at EuMW 2013, in booth #D104. On display will be Auriga's AU4850, a pulsed IV/RF characterization system, and its fourth generation component test system: CTS-4.
Mesuro has launched a new test solution that utilizes an ‘envelope load pull technique’, along with the latest generation of commercial off-the-shelf PXI hardware and LabVIEW system design software from National Instruments.
Lake Shore Cryotronics Inc. will attend the IEEE MTT International Microwave Symposium 2013 (IMS) in Seattle, WA June 2-7, where it will showcase its family of cryogenic and cryogen-free probe stations for characterizing the performance of early stage devices and materials. IMS is an international gathering of technologists involved in all aspects of microwave theory and practice, particularly those in RF, microwave, millimeter wave, and terahertz (THz) frequencies.
Keithley Instruments Inc. announces enhancements to its Automated Characterization Suite (ACS) software that support its expanding family of high power semiconductor characterization solutions.
Agilent Technologies Inc. announced an enhanced solution for PCI Express® 3.0 receiver characterization at DesignCon.
With IC-CAP 2013.01, Agilent introduces major improvements to its flagship product for high-frequency device modeling. One key improvement is turnkey extraction of the Angelov-GaN model, the industry standard compact device model for GaN semiconductor devices.
EDI CON 2013 (March 12-14, Beijing, China), the industry-driven event for RF, microwave and high speed digital electronic design announces the recent addition of several leading RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers as participants in the technical program and exhibition. As solution providers in high frequency electronic design and system integration, experts from these companies will offer attendees the latest information on the technology used in today’s communications and aerospace industries.