Articles Tagged with ''semiconductor''

China Mobile TD-LTE deployment extended through 2014

Mobile Experts has released updated base station and transceiver forecasts, which indicate a major disruption in the market for China Mobile TD-LTE production. RF semiconductor suppliers are ramping up production which corresponds with delivery of 207,000 TD-LTE base stations. However, despite widespread media reports that 200,000 base stations will be deployed during 2013, industry semiconductor suppliers indicate that production and deployment limitations will stretch deliveries over a period of roughly 18 months.


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Hesse Mechatronics debuts dual-head wedge bonder in the Americas

Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders and ribbon bonders for the backend semiconductor industry, announces that it will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.


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