Mobile Experts released a report that predicts a new future for base station semiconductors. In particular, the number of base station transceivers will grow to more than 17 million per year by 2017. Increasing bandwidth requirements, MIMO, and carrier aggregation will drive growth in key semiconductor components. The new report, "Semiconductors for Macro Transceivers and RRH," gives a detailed analysis of these trends.
U.S. PMI data for July 2012 stays flat at 49.8 from 49.7 in June 2012, this is indicative of a wider global malaise that is mirrored by not only other regional PMI index’s but also the results of major Semiconductor vendors. Lack of manufacturing capacity for key components coupled with the lack of investment in new fab space mean that this problem is likely to continue for a number of months and will eventually limit the availability of key flagship mobile products.
In IMS booth #3513 in Montreal, Canada this week, KCB, an AS-9100 certified designer and manufacturer of hi-rel SMT devices, is introducing some of their most recent semiconductor packaging techniques. One such technique, recently employed for a military customer in the AESA radar market, was a custom hermetic device that included two chips, a driver, on-board DPS, a DVA capability, and a PA stage.
Peregrine Semiconductor Corp. (Peregrine), a leading provider of high-performance radio-frequency (RF) integrated circuits (ICs) announced that the U.S. International Trade Commission (ITC) has launched an investigation into whether RF Micro Devices Inc. (RFMD) products infringe certain Peregrine patents relating to RF ICs and switch technology. The action and investigation further include Motorola Mobility Inc. and HTC Corp. (HTC), whose products incorporate the alleged infringing RF ICs.
Researchers at MIT have found a new way of making complex three-dimensional structures using self-assembling polymer materials that form tiny wires and junctions. The work has the potential to usher in a new generation of microchips and other devices made up of submicroscopic features.
RF Micro Devices Inc. (RFMD), a leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced the retirement of Bob Van Buskirk, corporate vice president of RFMD's Compound Semiconductor Group (CSG).
Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, a manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, recently opened a West Coast Demo and Applications Laboratory to provide enhanced applications and field support to customers throughout the western region.