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Articles Tagged with ''semiconductor''

Hesse Mechatronics debuts dual-head wedge bonder in the Americas

Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders and ribbon bonders for the backend semiconductor industry, announces that it will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.


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Element Six acquires the assets and intellectual property of Group4 Labs

Element Six, the world leader in synthetic diamond supermaterials and member of the De Beers Group of Companies, announced it has acquired the assets and intellectual property of Group4 Labs Inc. (Group4), a semiconductor wafer materials company that manufactured Gallium Nitride (GaN) on-diamond semiconductor technology for RF and high-power devices.


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Richardson RFPD at EDI CON 2013

Richardson RFPD Inc. announces its attendance and participation at EDI CON 2013. EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets.


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