Articles Tagged with ''designs''

UBM Tech, the electronics industry’s daily source of essential business and technical information, released the DesignCon 2014 technical program. Created by engineers for engineers, DesignCon’s award-winning technical program provides attendees with four days of intensive technical learning and networking opportunities, enabling chip, board and systems designers, software developers and silicon manufacturers to expand their design expertise. DesignCon will be held January 28-31, 2014 in Santa Clara, CA. 

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multi-layer Printed Circuit Boards (PCBs), announced its new low loss, low skew, high-speed material, GigaSync™. This product has been engineered to eliminate skew issues in high-speed designs that use differential pairs to create a balanced transmission system able to carry differential (equal and opposite) signals across a printed circuit board. 

API Technologies Corp., a provider of RF/microwave, microelectronics, and security solutions for critical and high-reliability applications, has expanded its power amplifier line of products to include the latest in GaN technology driven designs. This expanded line is specially intended for use in electronic warfare, RCIED countermeasures, and national security jammer applications where the use of rugged and highly reliable power amplifier designs is mission critical.

Analog Devices Inc., in collaboration with Xilinx® Inc. and MathWorks Inc., is launching a series of design conferences for analog, mixed-signal and embedded systems engineers. Based on the theme “Discuss. Design. Deliver.,” the conferences will bring together experts in high-performance analog, field-programmable gate arrays (FPGA) and modeling tools to present complete signal chain and system-ready solutions for complex design challenges.

Agilent Technologies Inc. announced that Plextek RF Integration, a UK-based  company that designs and develops RFICs, MMICs and microwave/millimeter-wave modules, has selected Agilent software to simulate its new high-frequency circuit and MMIC designs.

Michael Casper, president and CEO of UltraSource Inc., a thin film microchip manufacturer, is pleased to announce the update of an application note on the company's website titled: “How Your CAD File Affects the Success of Your New Thin Film Design.”

Coaxicom’s innovative 1 W 3900X series terminations are designed to minimize reflected power that often impedes transmission quality. Used across a spectrum of multi-port microwave devices including directional couplers, isolators and high-power transmitter applications, terminations absorb energy and prevent RF signals from reflecting back from open-ended or unused circuit ports.

EMSCAN will showcase the world's largest real-time antenna pattern measurement tool in Amsterdam at  EuMW 2012.

Mesuro, the Cardiff University spin-out that offers testing and services solutions for the semiconductor industry, announced completion of a £700k funding round to expand its overseas sales and device characterisation capabilities.