- Buyers Guide
The M2M market has become a fully mainstream segment of the cellular industry.
L-com, Inc., a designer and manufacturer of wired and wireless connectivity products, has signed a formal distribution agreement with ARROW Technologies of Bangalore, India, which ensures distribution rights for L-com's connectivity products in one of the world's fastest growing economies.
TE Connectivity's Aerospace, Defense & Marine business announces its new community-centered website for design engineers, www.DesignSmarterFaster.com. The new site is meant to be a resource center for design engineers to connect directly with TE Subject Matter Experts (SMEs) who can advise and team up with them early in the design process to help bring their products and systems to market faster with smarter, better solutions.
Emerson Network Power Connectivity Solutions, a business of Emerson and a global leader in protecting and optimizing critical infrastructure, announces the new Trompeter T24 catalog highlighting products for military, space and testing applications.
Texas Instruments Inc. (TI) announced availability of a complete solution for mobile devices designed to support Wi-Fi CERTIFIED Miracast™, based on the Wi-Fi Alliance® Wi-Fi Display Specification, enabling users to reliably display full high definition (HD) content from a mobile device onto a larger screen over a secure, low-latency, wireless network connection.
Texas Instruments Inc. (TI) introduced a new member of its high performance sub-1 GHz radio frequency (RF) family providing unmatched connectivity for low-power wireless security, Smart Grid, industrial, healthcare, and home and building automation applications. The new CC1125 sub-1 GHz RF transceiver is the industry’s first single-chip solution for wireless social alarms and ultra narrowband applications, targeting ETSI EN 300 220 category 1 (ETSI Cat.1) compliance for the European 869 MHz band.
The total market for standards-based wireless connectivity chipsets is expected to exceed $10 billion in 2012, this includes both standalone and combo chipsets that use Bluetooth, Wi-Fi, GPS, NFC, UWB, and ZigBee. “The market continues to develop with technologies - particularly Bluetooth and Wi-Fi - squaring up for a fight to be the dominant standard,” commented Peter Cooney, wireless connectivity practice director.
Texas Instruments Inc. (TI) introduced its end-to-end Miracast system, comprised of source and display (sink) solutions that enable consumers to stream media, games, photos and other digital content from mobile devices to larger screens. Based on TI's OMAP™ platform, DaVinci™ video processors and WiLink™ connectivity family, the Miracast solutions deliver best-in-class video quality and market leading low latency over a secure Wi-Fi connection.
Emerson Network Power Connectivity Solutions, a business of Emerson and a global leader in maximizing availability, capacity and efficiency of critical infrastructure, announces the launch of their new Chinese language website on emersonconnectivity.com.
The total Bluetooth IC market (including stand alone and combo ICs) is expected to reach $4.3 billion in 2012 — an increase of 21% on 2011. Revenues are forecast to grow at a compound growth rate of over 20% to reach almost $12 billion by 2017.
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