advertisment Advertisement
This ad will close in  seconds. Skip now
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement

Articles Tagged with ''technology''

Molex introduces electromagnetic interference absorption tape and sheets

Molex Inc.
No Comments

Molex Inc. launched its innovative HOZOX™ Electromagnetic Interference (EMI) Absorption Tape and Sheets, ideally suited for manufacturers of high-frequency equipment in multiple industries, including medical, consumer electronics, data/telecommunications and microwave/radio frequency.  HOZOX absorption technology utilizes a unique dual-layer design to maximize the EMI noise mitigation performance.  .


Read More

Vishay launches automotive-grade precision thin film chip resistor laboratory sample kits

Vishay Intertechnology Inc.
No Comments

Vishay Intertechnology Inc. announced that the company is now offering laboratory sample kits of its automotive-grade precision thin film chip resistors. The MCW 0406 AT (LCW AT 96/4)  and MCT 0603 AT (LCT AT 96/4) kits aid engineers in prototyping, and speed time to market in a wide range of electronic systems.


Read More

DOT to require V2V communications on all light vehicles

AUVSI
One Comment

The U.S. Department of Transportation’s National Highway Traffic Safety Administration announced that it is going to create a formal path forward for vehicle-to-vehicle communication for light vehicles. This means that NTHSA will start regulatory proposals on how this technology could become mandatory in the future. 


Read More

Intercept Technology intros the next level in design reuse: virtual blocks

Software/EDA
Intercept Technology Inc.
No Comments

Intercept Technology Inc., a leading provider of PCB, RF, Hybrid, and high-speed design software, recently released a version of its Mozaix schematic design software that no longer requires top level sheets and block symbols to build hierarchy in a schematic. 


Read More

Dr. Song Junde to give keynote speech at EDI CON 2014 as conference chairman emeritus

EDI CON
No Comments

EDI CON 2014 has announced that Dr. Song Junde, professor at the Beijing University of Posts and Telecommunications, will serve as the chairman emeritus of the second annual technical conference and trade exposition focused on RF, microwave and high-speed digital design. Junde, who held the role of honorary chair for the inaugural EDI CON in March of 2013, will once again provide guidance to the event organizers and technical program planning committee in the development of a technical conference focused on advancing microwave technology and the communications industry in China. 


Read More

Boeing transmits protected government signal through military satellite

Boeing
No Comments

Boeing has applied new anti-jamming technology to an existing military satellite for the first time, expanding the military's potential to access secure communications more affordably.


Read More

EJL Wireless Research announces its 2014 predictions for wireless RAN technology

EJL Wireless Research
No Comments

EJL Wireless Research is unveiling its predictions for wireless RAN technology for 2014 in a new white paper.


Read More

CEA-Leti signs agreement with Qualcomm to assess sequential 3D technology

CEA-Leti
No Comments

CEA-Leti announced an agreement with Qualcomm Technologies Inc., a subsidiary of Qualcomm Inc., to assess the feasibility and the value of Leti’s sequential 3D technology.


Read More

DARPA selects Rockwell Collins to develop prototype for next gen SDRs

Aerospace & Defense
Rockwell Collins
No Comments

A Rockwell Collins receiverRockwell Collins has been selected by the Defense Advanced Research Projects Agency to develop a direct conversion digital receiver based on photonic technology. The three-year contract for the DISARMER program is valued up to $8.5 million.


Read More

Ball Aerospace Green Propellant Mission to test new thermal insulation

Ball Aerospace & Technologies Corp.
No Comments

NASA’s Green Propellant Infusion Mission (GPIM) has been selected to test an advanced form of thermal insulation, called integrated multi-layer insulation (IMLI) that could become standard on future satellites and cryogenic subsystems. Validating this new insulation in space will help NASA build the technology required for long human spaceflight missions. Under a subcontract from Ball Aerospace & Technologies Corp., Quest Thermal Group LLC will manufacture the new insulation that will fly aboard the 2015 GPIM mission.


Read More

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement