Rice University engineers have demonstrated the first system that allows wireless data transmissions over UHF channels during active TV broadcasts. If the technology were incorporated into next-generation TVs or smart remotes, it could significantly expand the reach of so-called "super Wi-Fi" networks in urban areas.
Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the UltraCMOS® 11 platform, the industry’s first RF SOI technology built on GLOBALFOUNDRIES’ 130 nm 300 mm RF technology platform.
San-tron Inc., a leading manufacturer of RF and microwave coaxial connectors and cable assemblies, announced that they have attained their certification under the United States/Canada Joint Certification Program (JCP).
POET Technologies Inc. – developer of the planar opto-electronic technology (“POET”) platform for monolithic fabrication of integrated circuit devices containing both electronic and optical elements on a single semiconductor wafer – is extremely pleased to announce the appointment of Dr. Suresh Venkatesan as CEO of the company.
Teledyne Microwave Solutions revealed a new line of YIG tuned band-reject filters that covers the frequency range of 125 MHz to 18 GHz. Powered by a new patent-pending technology that overcomes several of the long-time design limitations inherent to YIG Band-Reject, or “notch” filters, the new TMS product line delivers to customers several major performance advancements that are unparalleled to date in the industry.
Radio Frequency and Electromagnetics Exchange (RFEMX) is announces its opening at IMS2015. Jean-Jacques DeLisle, MSEE, is founding RFEMX as a technical writing and media content creation organization with expertise in the RF, IoT, and EW industries. From feature articles to technical papers, RFEMX offers an engineer's expertise and a writers flare to conveying technical content with authority.
WIN Semiconductors Corp., the world’s largest pure-play compound semiconductor foundry, announced the release of its sixth generation Enhancement-Depletion mode GaAs Pseudomorphic HEMT technology for high performance RF and mmWave applications.
Cirexx International announced that they will be presenting their ECLIPS technology at IMS2015 in Phoenix, Ariz., May 17-22. Cirexx will be in Booth # 2023. ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF/microwave printed circuit boards (PCBs) employing an embedded low-CTE, thermally engineered metalized heat-sink layer which has superior thermal conductivity characteristics.
Visit Intercept Technololgy at IMS2015, May 17-22 at Booth # 948 for a look at the company's ADS Board Link interface. It uses Keysight's ABL format to import schematic and layout information, in tandem with a library of ADS models in Intercept format.