advertisment Advertisement
This ad will close in  seconds. Skip now
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement

Articles Tagged with ''technology''

UltraSource Inc. announces PolyVia – a reduced cost plugged via

 UltraSource, Inc. announced that it has developed a reduced cost plugged via option called PolyVia.  PolyVia was recently showcased at the IEEE-IMS, Tampa Bay, on June 3-5.  The PolyVia product is a polyimide-based plugged via option that customers can add to their plated-through hole designs in order to stop epoxy or solder bleed-thru during assembly operations. 


Read More

At CommunicAsia 2014, Teledyne Paradise Datacom showcases advancements in modem technologies

 At the CommunicAsia 2014 event in Singapore, Teledyne Paradise Datacom, a business unit of Teledyne Microwave Solutions, will be showcasing advancements in modem technology the company has made across the board in its “Q” series of modem solutions.  Focusing on reducing space segment costs and delivering numerous other leading-edge features in satcom modem technology, the company will be exhibiting at Stand IQ2-08 in the U.S. Pavilion. 


Read More

TI and Netas collaborate on LTE-Advanced macro base station in Turkey

Texas Instruments and Netas, a Turkish based value-added systems integration and technology services company in the fields of information and communications, announced their collaboration on an LTE-Advanced (LTE-A) macro base station for a new public safety network commissioned by the government of Turkey. Netas has selected TI's KeyStoneTM-based wireless infrastructure System-on-Chip (SoC), the TCI6638K2K, for the baseband processing in the solution, while implementing its own proprietary software.


Read More

Cirexx presents ECLIPS at IMS 2014

Cirexx International is presenting the new ECLIPS technology this week at the International Microwave Symposium (IMS) at the Tampa Convention Center.  ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF and microwave Printed Circuit Boards (PCBs) employing an embedded low-CTE, thermally engineered metalized layer which has superior thermal conductivity characteristics.


Read More

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement