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Articles Tagged with ''technology''

Ball Aerospace Green Propellant Mission to test new thermal insulation

November 15, 2013

NASA’s Green Propellant Infusion Mission (GPIM) has been selected to test an advanced form of thermal insulation, called integrated multi-layer insulation (IMLI) that could become standard on future satellites and cryogenic subsystems. Validating this new insulation in space will help NASA build the technology required for long human spaceflight missions. Under a subcontract from Ball Aerospace & Technologies Corp., Quest Thermal Group LLC will manufacture the new insulation that will fly aboard the 2015 GPIM mission.


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FCC seeks comment on IEEE-USA petition for spectrum to spur new technologies

November 7, 2013

The Federal Communications Commission is soliciting public comments on an IEEE-USA petition asking the federal government to classify frequency spectrum above 95 GHz as “a new technology or service.”


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High-tech tractors cultivate a sustainable future

November 1, 2013

The face of traditional farming is rapidly changing to incorporate sophisticated technologies aimed at producing more food with less environmental impact. To support the influx of technology, product development firm Cambridge Consultants is using its expertise to design innovative, low-cost solutions for the farming industry. Its latest device draws on its background in advanced radar technology for a detection system to help agricultural vehicles avoid collisions.


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Peregrine and GLOBALFOUNDRIES collaborate to advance RF SOI technology

October 31, 2013

Peregrine Semiconductor Corp., founder of RF silicon on insulator (SOI) and pioneer of advanced RF solutions, and GLOBALFOUNDRIES, a leading provider of semiconductor manufacturing technology, are sampling the first RF Switches built on Peregrine’s new UltraCMOS 10 RF SOI technologies. This partnership unites Peregrine’s 25 years of RF SOI experience with a tier-one foundry.


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Peregrine introduces UltraCMOS 10 technology

RFIC
October 30, 2013

Peregrine Semiconductor Corp. announces the UltraCMOS 10 platform, the newest advancement in Peregrine’s UltraCMOS technology. UltraCMOS 10 RF SOI delivers both flexibility and unparalleled performance for addressing the ever-increasing challenges of RF front-end design.


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Comtech Xicom Technology offers new MIL-SATCOM SSPA BUCs

October 28, 2013

Comtech Xicom Technology Inc., a technology leader of high power amplifier products for satellite communication (SATCOM) announces new military satellite communication (MIL-SATCOM) solid-state power amplifier block upconverters will be presented during MILCOM'13.


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Fujitsu develops PA technology with industry-leading efficiency

October 15, 2013

Fujitsu Laboratories Ltd. announced the development of circuit technology that enables industry-leading electrical efficiency (the ratio between output power and consumed power) for wireless transmission power amplifiers used in radio-frequency wireless devices, such as mobile phone base stations.


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NASA, Homeland Security test disaster recovery tool

September 27, 2013

NASA and the U.S. Department of Homeland Security are collaborating on a first-of-its-kind portable radar device to detect the heartbeats and breathing patterns of victims trapped in large piles of rubble resulting from a disaster.


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More than 50% of remote controls shipped in 2018 will be RF enabled

September 25, 2013

In 2013 10 percent of the remote controls shipped with major home consumer equipment will be RF-enabled.  Over the next five years there will be a major surge in RF technology adoption for remote controls as vendors look to differentiate their products, and/or drive growth in smart home services.  While at the same time RF solutions continue to fall in price, implementations become more simplified and lower powers are achieved.


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MACOM introduces industry’s first surface mount L-Band 90W GaN power module

September 24, 2013

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance RF, microwave, and millimeter wave products, today announced the newest entry in its portfolio of GaN in Plastic packaged power products. Optimized for L-Band commercial air traffic control, military radar, and long range perimeter monitoring applications at 1.2 to 1.4 GHz, MACOM’s new 2-stage, fully matched GaN in Plastic power module scales to peak pulse power levels of 100W in a 14 x 24 mm package size – delivering twice the power of comparably sized competing products.


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