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Articles Tagged with ''technology''

TriQuint drives LTE advances with a growing line of high-performance filters

February 11, 2014

TriQuint Semiconductor Inc., a leading RF solutions supplier and technology innovator, announced several new premium filters for next-generation smartphones and other mobile devices. The high-performance filters utilize the company’s advanced acoustic wave filtering technologies to address some of the industry’s toughest LTE interference problems.


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Molex introduces electromagnetic interference absorption tape and sheets

February 11, 2014

Molex Inc. launched its innovative HOZOX™ Electromagnetic Interference (EMI) Absorption Tape and Sheets, ideally suited for manufacturers of high-frequency equipment in multiple industries, including medical, consumer electronics, data/telecommunications and microwave/radio frequency.  HOZOX absorption technology utilizes a unique dual-layer design to maximize the EMI noise mitigation performance.  .


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Vishay launches automotive-grade precision thin film chip resistor laboratory sample kits

February 7, 2014

Vishay Intertechnology Inc. announced that the company is now offering laboratory sample kits of its automotive-grade precision thin film chip resistors. The MCW 0406 AT (LCW AT 96/4)  and MCT 0603 AT (LCT AT 96/4) kits aid engineers in prototyping, and speed time to market in a wide range of electronic systems.


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DOT to require V2V communications on all light vehicles

February 5, 2014

The U.S. Department of Transportation’s National Highway Traffic Safety Administration announced that it is going to create a formal path forward for vehicle-to-vehicle communication for light vehicles. This means that NTHSA will start regulatory proposals on how this technology could become mandatory in the future. 


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Intercept Technology intros the next level in design reuse: virtual blocks

Software/EDA
January 30, 2014

Intercept Technology Inc., a leading provider of PCB, RF, Hybrid, and high-speed design software, recently released a version of its Mozaix schematic design software that no longer requires top level sheets and block symbols to build hierarchy in a schematic. 


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Dr. Song Junde to give keynote speech at EDI CON 2014 as conference chairman emeritus

January 27, 2014

EDI CON 2014 has announced that Dr. Song Junde, professor at the Beijing University of Posts and Telecommunications, will serve as the chairman emeritus of the second annual technical conference and trade exposition focused on RF, microwave and high-speed digital design. Junde, who held the role of honorary chair for the inaugural EDI CON in March of 2013, will once again provide guidance to the event organizers and technical program planning committee in the development of a technical conference focused on advancing microwave technology and the communications industry in China. 


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Boeing transmits protected government signal through military satellite

January 13, 2014

Boeing has applied new anti-jamming technology to an existing military satellite for the first time, expanding the military's potential to access secure communications more affordably.


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EJL Wireless Research announces its 2014 predictions for wireless RAN technology

January 7, 2014

EJL Wireless Research is unveiling its predictions for wireless RAN technology for 2014 in a new white paper.


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CEA-Leti signs agreement with Qualcomm to assess sequential 3D technology

December 9, 2013

CEA-Leti announced an agreement with Qualcomm Technologies Inc., a subsidiary of Qualcomm Inc., to assess the feasibility and the value of Leti’s sequential 3D technology.


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DARPA selects Rockwell Collins to develop prototype for next gen SDRs

Aerospace & Defense
December 3, 2013

A Rockwell Collins receiverRockwell Collins has been selected by the Defense Advanced Research Projects Agency to develop a direct conversion digital receiver based on photonic technology. The three-year contract for the DISARMER program is valued up to $8.5 million.


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