Articles Tagged with ''technology''

Comtech Telecommunications Corp. announced that its Santa Clara, California-based subsidiary, Comtech Xicom Technology, Inc., has been awarded a contract totaling $1.4 million from a major system integrator to supply rack-mount, high-power amplifiers ("HPAs"). The HPAs will be used in an expansion of a system that relays military satellite communications around the world and that is already using similar Comtech Xicom HPAs.

TriQuint Semiconductor Inc., a leading RF solutions supplier and technology innovator, announced several new premium filters for next-generation smartphones and other mobile devices. The high-performance filters utilize the company’s advanced acoustic wave filtering technologies to address some of the industry’s toughest LTE interference problems.

Molex Inc. launched its innovative HOZOX™ Electromagnetic Interference (EMI) Absorption Tape and Sheets, ideally suited for manufacturers of high-frequency equipment in multiple industries, including medical, consumer electronics, data/telecommunications and microwave/radio frequency.  HOZOX absorption technology utilizes a unique dual-layer design to maximize the EMI noise mitigation performance.  .

Vishay Intertechnology Inc. announced that the company is now offering laboratory sample kits of its automotive-grade precision thin film chip resistors. The MCW 0406 AT (LCW AT 96/4)  and MCT 0603 AT (LCT AT 96/4) kits aid engineers in prototyping, and speed time to market in a wide range of electronic systems.

The U.S. Department of Transportation’s National Highway Traffic Safety Administration announced that it is going to create a formal path forward for vehicle-to-vehicle communication for light vehicles. This means that NTHSA will start regulatory proposals on how this technology could become mandatory in the future. 

Intercept Technology Inc., a leading provider of PCB, RF, Hybrid, and high-speed design software, recently released a version of its Mozaix schematic design software that no longer requires top level sheets and block symbols to build hierarchy in a schematic. 

EDI CON 2014 has announced that Dr. Song Junde, professor at the Beijing University of Posts and Telecommunications, will serve as the chairman emeritus of the second annual technical conference and trade exposition focused on RF, microwave and high-speed digital design. Junde, who held the role of honorary chair for the inaugural EDI CON in March of 2013, will once again provide guidance to the event organizers and technical program planning committee in the development of a technical conference focused on advancing microwave technology and the communications industry in China. 

Boeing has applied new anti-jamming technology to an existing military satellite for the first time, expanding the military's potential to access secure communications more affordably.

EJL Wireless Research is unveiling its predictions for wireless RAN technology for 2014 in a new white paper.

CEA-Leti announced an agreement with Qualcomm Technologies Inc., a subsidiary of Qualcomm Inc., to assess the feasibility and the value of Leti’s sequential 3D technology.