Articles Tagged with ''technology''

 Micron Technology Inc. announced that Stephen Pawlowski has been named as vice president of Advanced Computing Solutions.  

 Anritsu, a global leader in wireless telecommunications test equipment, announces that it is the market’s leading supplier of the first industry approved protocol conformance test cases for mobile devices capable of receiving evolved Multimedia Broadcast Multicast Services (eMBMS) broadcasts.  

 Advantech Wireless a privately-held Canadian corporation and manufacturer of satellite, RF equipment and microwave systems announced that its SapphireBlu™ series of UltraLinear™ GaN technology based high power amplifiers have empowered the ultra HDTV transmissions of the most viewed sporting event of the year. 

 Global penetration of V2X modules in new vehicles will reach 62 percent by 2027. The total installed base of OEM and aftermarket DSRC V2X modules in vehicles will grow to 423 million by 2027. 

 Using the electromagnetic (EM) simulation tool, CST STUDIO SUITE®, Kymeta Corp. designs a novel range of lightweight portable antennas for mobile satellite communications. 

 UltraSource, Inc. announced that it has developed a reduced cost plugged via option called PolyVia.  PolyVia was recently showcased at the IEEE-IMS, Tampa Bay, on June 3-5.  The PolyVia product is a polyimide-based plugged via option that customers can add to their plated-through hole designs in order to stop epoxy or solder bleed-thru during assembly operations. 

 The WhiteSpace Alliance (WSA) ®, a global industry organization enabling sharing of underutilized spectrum, today announced that NuRAN Wireless™ has joined the organization. 

 At the CommunicAsia 2014 event in Singapore, Teledyne Paradise Datacom, a business unit of Teledyne Microwave Solutions, will be showcasing advancements in modem technology the company has made across the board in its “Q” series of modem solutions.  Focusing on reducing space segment costs and delivering numerous other leading-edge features in satcom modem technology, the company will be exhibiting at Stand IQ2-08 in the U.S. Pavilion. 

Texas Instruments and Netas, a Turkish based value-added systems integration and technology services company in the fields of information and communications, announced their collaboration on an LTE-Advanced (LTE-A) macro base station for a new public safety network commissioned by the government of Turkey. Netas has selected TI's KeyStoneTM-based wireless infrastructure System-on-Chip (SoC), the TCI6638K2K, for the baseband processing in the solution, while implementing its own proprietary software.

Cirexx International is presenting the new ECLIPS technology this week at the International Microwave Symposium (IMS) at the Tampa Convention Center.  ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF and microwave Printed Circuit Boards (PCBs) employing an embedded low-CTE, thermally engineered metalized layer which has superior thermal conductivity characteristics.