- Buyers Guide
Transline Technology, an Anaheim, CA based Printed Circuit Board Manufacturer, underwent the first phase of registration for AS-9100 Rev C which involved review of all of their manuals and internal documentation.
Machine-to-machine (M2M) communication is poised to change the way critical services are delivered over the next decade, from healthcare to transport to energy. Significant barriers remain however, including overcoming technical complexity and regulatory hurdles that will pave the way for innovative products and services.
Linwave Technology is pleased to announce appointment of Neil Sparling to the role of technical director.
Horizon House has announced plans to launch the inaugural Electronic Design Innovation Conference (EDI CON 2013) in Beijing, China in March 2013 that will focus on design concepts and techniques of RF, microwave and high-speed digital components and systems in China
Excitement builds as the Safety Pilot Model Deployment of 2,880 cars is underway as announced by the Honorable Ray LaHood, USDOT Secretary in a joint press conference with the University of Michigan Transportation Research Institute (UMTRI). This deployment, the largest real-life test of cars talking to cars, uses the latest wireless technology for safe and secure connectivity.
Researchers from A*STAR’s Institute of Microelectronics (IME) have developed the first compact high performance silicon-based cavity-backed slot (CBS) antenna that operates at 135 GHz. The antenna demonstrated 30 times stronger signal transmission over on-chip antennas at 135 GHz. At just 1.6 mm x 1.2 mm, approximately the size of a sesame seed, it is the smallest silicon-based CBS antenna reported to date for ready integration with active circuits.
Endicott Interconnect Technologies Inc. (EI) announced the promotion of Rajinder Rai to the position of chief technology officer (CTO) reporting to James J. McNamara Jr., president and CEO. In his new position, Raj will be responsible for monitoring new technologies, overseeing the selection of research projects, generating a technology road-map and ensuring its progress and assessing the potential of new product introduction.
Nujira Ltd., the world leader in envelope tracking (ET) technology, has announced that is sampling its next generation ET IC for mobile handsets, the NCT-L1200, to lead partners. The second product in its Coolteq.L ET product family, Nujira’s NCT-L1200 has already been delivered to several key platform chipset vendors, and is the only product currently available on the market that supports the maximum 20MHz channel bandwidth of LTE.
Thales Canada announced that its R&D facility in Parc du Technologique is now an official Thales Research and Technology (TRT) centre – the fifth in the world and first in North America.
After many years of waiting, 60 GHz technology looks set to emerge from a niche technology to a mass market solution. The main enabler has been the linking of the WiGig Alliance with the Wi-Fi Alliance and the forthcoming ratification of the 802.11ad standard which will encourage more Wi-Fi IC vendors to add 11ad to future tri-band solutions (i.e., 11n / 11ac / 11ad).
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