Open air is getting crowded. Signals streaming back and forth from smart devices stretch existing fourth-generation wireless networks almost to their limits. As demands on these systems increase, University of Wisconsin–Madison engineers aim to open new frontiers in cutting-edge wireless communications.
Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, and Peraso Technologies, a leading wireless chipset manufacturer, jointly announced their successful collaboration in developing a comprehensive test solution for Peraso’s recently-launched 60 GHz semiconductor products.
Keysight Technologies Inc., in collaboration with The University of California San Diego (UCSD), has demonstrated the world’s first 64 (8 x 8) and 256-element (16 x 16), 60 GHz silicon wafer-scale phased-array transmitter with integrated high-efficiency antennas for Gbps communications at 100 to 200 meters.
NI and Astronics Test Systems Inc., a wholly owned subsidiary of Astronics Corp. announced their collaborative efforts to deliver PXI-based products designed for the aerospace and defense community. The combination of Astronics’ strength in test system integration and NI’s leadership in PXI-based automated test systems is expected to produce a best-in-class portfolio for automated test equipment (ATE) applications.
Keysight Technologies Inc. announced that it signed a Memorandum of Understanding (MOU) with KT Corp. on May 20 at the KT R&D Center in Korea. The two companies will collaborate on 5G wireless communications and other related areas of interest.
POET Technologies Inc.,- developer of the planar opto-electronic technology ("POET") platform for monolithic fabrication of integrated circuit devices containing both electronic and optical elements on a single semiconductor wafer - announced the signing of a collaboration agreement with BAE Systems Microelectronics.
Ericsson and IBM announced a collaboration to jointly research phased-array antenna designs for 5G, allowing networks to provide customers with data speeds orders of magnitude faster than what is available currently.
RFMD, a global leader in the design and manufacture of high-performance radio frequency solutions, announced it is achieving excellent design success with an expanding portfolio of new power amplifiers (PAs), antenna switch modules and antenna control solutions for the rapidly growing global TD-LTE mobile phone market.
Micron Technology Inc., one of the world's leading providers of advanced semiconductor solutions, announced its collaboration with Broadcom Corp. to develop the industry's first solution designed for customers challenged by an intrinsic DDR3 timing parameter called tFAW, or four activate window.