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Articles Tagged with ''solder''

Indium Corp. experts reflect on 80 years of technology innovation and growth

March 14, 2014

What does it take to make it to 80 years in an industry where today’s technology is obsolete tomorrow? For Indium Corp., it takes foresight and dedication.


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Indium Corp. features new, high temperature, lead-free solder paste technology at Semicon China

March 4, 2014

Indium Corp. will feature its new high-melting lead-free solder paste technology, BiAgX™, at Semicon China on March 18-20 in Shanghai, China. 


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Indium Corp. hires Glen Thomas as product manager for solder paste

January 30, 2014

Indium Corp. announces that Glen Thomas has been named product manager for PCB assembly solder paste.  


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Rogers launched thermally and electrically conductive adhesive film

January 16, 2014

Rogers Corp. Advanced Circuit Materials Division launched COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) Film providing reliable high temperature performance.


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Indium8.9HF1-P delivers high first pass yields for in-circuit testing

December 10, 2013

Indium Corp. introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium’s unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.


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Indium Corp. wins global technology award

November 15, 2013

Indium Corp. was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12. 


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Indium Corp. features new, high-reliability solder alloy SACM at Productronica

October 30, 2013

Indium Corp. will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in Münich, Germany. 


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Indium introduces high-reliability low-voiding flux coating for solder preforms

October 10, 2013

Indium Corp. introduces a new, high-reliability, low-voiding flux coating for solder preforms. LV1000 reduces false failures while increasing productivity, throughput yields, and component performance. This new halide-free (ROL0) material is especially suited for assembly processes in which the components don’t allow for proper outgassing of volatized flux.


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ITT Exelis SideHat and Rifleman radios receive NSA certification

June 24, 2013

ITT Exelis received National Security Agency (NSA) certifications for its SideHat and the Soldier Radio-Rifleman (SR-R) radios. Certification allows the radios to operate up to the "SECRET" level and be fully integrated into the U.S. Army's tactical communications network. 


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IMS introduces non-magnetic chip resistors with ultra leach resistant terminals

March 25, 2013

International Manufacturing Services Inc. (IMS), a manufacturer of high quality thick film resistors, terminations, attenuators, couplers, thermal management devices, planar dividers and planar filters to the electronics industry, has introduced a new type of chip resistor terminal which are non-magnetic and ultra leach resistant.


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