- Buyers Guide
Articles Tagged with ''solder''
What does it take to make it to 80 years in an industry where today’s technology is obsolete tomorrow? For Indium Corp., it takes foresight and dedication.
Indium Corp. will feature its new high-melting lead-free solder paste technology, BiAgX™, at Semicon China on March 18-20 in Shanghai, China.
Indium Corp. announces that Glen Thomas has been named product manager for PCB assembly solder paste.
Rogers Corp. Advanced Circuit Materials Division launched COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) Film providing reliable high temperature performance.
Indium Corp. introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium’s unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.
Indium Corp. was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.
Indium Corp. will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in Münich, Germany.
Indium Corp. introduces a new, high-reliability, low-voiding flux coating for solder preforms. LV1000 reduces false failures while increasing productivity, throughput yields, and component performance. This new halide-free (ROL0) material is especially suited for assembly processes in which the components don’t allow for proper outgassing of volatized flux.
ITT Exelis received
International Manufacturing Services Inc. (IMS), a manufacturer of high quality thick film resistors, terminations, attenuators, couplers, thermal management devices, planar dividers and planar filters to the electronics industry, has introduced a new type of chip resistor terminal which are non-magnetic and ultra leach resistant.