Articles Tagged with ''switching''

WIN Semiconductors Corp., the world’s largest pure-play compound semiconductor foundry, announced the release of its sixth generation Enhancement-Depletion mode GaAs Pseudomorphic HEMT technology for high performance RF and mmWave applications.

Pickering Interfaces, a leading provider of modular signal switching and instrumentation for use in electronic test and simulation, is expanding its range of LXI switching matrices with the introduction of new high-density matrix modules.

Seven new modules have been added to the R&S OSP open switch and control platform from Rohde & Schwarz.

 Accel-RF Instruments Corp., the worldwide leader in turn-key reliability and performance characterization test Systems for compound semiconductors, announces its participation in the upcoming ESREF Exhibition in Berlin, Germany. The ESREF conference will take place September 29 through October 2 at the Technische Universität Berlin (TUB). 

 The AXIe Consortium announced a new specification, AXIe-0, suitable for low-cost instrumentation and switching.  

 Peregrine Semiconductor Corp. introduces the UltraCMOS® PE42424 high-isolation, SPDT switch optimized for 802.11ac carrier and enterprise Wi-Fi access points.  

Accel-RF Instruments Corp. announces its participation in the upcoming CS MANTECH Exhibition in Denver, CO. The MANTECH conference will take place May 19 through 22 at the Downtown Denver Sheraton.

The LTC3624 is a high efficiency, 17V input capable synchronous buck regulator from Linear Technology that delivers up to 2A of continuous output current to outputs as low as 0.6V. Synchronous rectification delivers efficiencies as high as 95% while Burst Mode® operation requires only 3.5µA of no load quiescent current.

Pickering Interfaces, a leading provider of modular signal switching and instrumentation for use in electronic test and simulation, is expanding its range of PCI switching solutions with the introduction of seven new PCI cards and expansion of an eighth card.

SemiGen Inc., an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, offers PIN diodes that feature low capacitance and resistance, high reliability, and easy bonding with F.A.C. mesas. These devices are typically manufactured with either a robust thermal-oxide passivation or ceramic glass for durable high-power applications. These diodes are made with a grown junction P++ layer that yields abrupt junction structures.