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Articles Tagged with ''technologies''

UBM Tech will welcome thousands to DesignCon 2014 next week

UBM Tech, the daily source of essential business and technical information for decision makers in the electronics industry, will welcome thousands of influential members of the chip, package and board design communities to DesignCon 2014, January 28 – 31, at the Santa Clara Convention Center in Santa Clara, California. Recognized as the premier annual trade event and technical conference dedicated to the pervasive nature of signal integrity at all levels of electronic design, DesignCon will host Keynote Speakers from Intel, Micron Technologies and XPRIZE.  


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API Technologies receives $1.4M for power systems

API Technologies Corp., a leading provider of high performance RF/microwave, power, and security solutions for critical and high-reliability applications, announced today that it has received a new, $1.4 million order for TPS75 Tactical Power Supplies. The company-designed power systems, which debuted at the Association of the United States Army (AUSA) Annual meeting and Exposition in October, will be used by the U.S. Department of Defense as a lightweight, mobile power supply to support a variety of C4ISR, UAV, and mission control applications.


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Agilent's model extraction and qualification software adopted by Microchip Technology

Agilent Technologies Inc. announced that Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, has adopted Agilent EEsof EDA’s Model Builder Program and Model Quality Assurance software. Microchip Technology will use the software to create internal fabrication device model libraries or process design kits, modify external foundry libraries, and validate supported devices from internal and external sources.


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Cree SiC MOSFETs revolutionize HEV/EV power converters

Cree Inc. announces that Shinry Technologies, a premier high-tech enterprise focused on energy efficient applications in transportation and lighting, employed Cree’s 1200V C2M family of SiC MOSFETs in its new, high-efficiency, hybrid electric and electric vehicle (HEV/EV) power converters to achieve industry-leading 96 percent efficiency.  According to Shinry Technologies, Cree’s C2M SiC MOSFETS also enabled a 25 percent reduction in product size and reduced peak power losses by over 60 percent compared to the traditional silicon versions.


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Peregrine and GLOBALFOUNDRIES collaborate to advance RF SOI technology

Peregrine Semiconductor Corp., founder of RF silicon on insulator (SOI) and pioneer of advanced RF solutions, and GLOBALFOUNDRIES, a leading provider of semiconductor manufacturing technology, are sampling the first RF Switches built on Peregrine’s new UltraCMOS 10 RF SOI technologies. This partnership unites Peregrine’s 25 years of RF SOI experience with a tier-one foundry.


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