Molex Inc. will present leading edge high-speed, high-density solutions at the 39th European Conference on Optical Communication (ECOC 2013) being held September 22-26 at the ICC London ExCEL, England. ECOC is the largest European optical communications event for the fiber optic industry.
By 2018, ABI Research expects annual home automation device shipments to exceed 351 million, growing at a CAGR of 78 percent. ZigBee dominated IEEE 802.15.4 and claimed the top share of node shipments at 4.5 million, narrowly beating out proprietary protocol offerings.
ABI Research estimates that the installed base of Bluetooth-enabled devices alone reached 3.5 billion in 2012 and is forecast to grow to almost 10 billion by 2018—this doesn’t take into account many other technologies such as Wi-Fi, ZigBee, and cellular.
API Technologies Corp., a trusted provider of RF/microwave, microelectronics, and security solutions for critical and high-reliability applications, announced that it will showcase a wide range of RF, microwave, and millimeter wave products at Booth #744 during the 2013 IEEE International Microwave Symposium (IMS2013). The IMS 2013 Exhibition takes place June 4-6 at the Washington State Convention Center in Seattle.
TMD Technologies Ltd., an innovative leader in microwave technology, has opened a US subsidiary and appointed Mike Farley as its CEO. Based in Baltimore, MD, TMD Technologies LLC will offer a significant benefit to U.S. customers, bringing local technical support, dealing with export compliance and handling classified interchanges.
Medical devices that send small amounts of data wirelessly will be able to run for months or even years on a coin cell battery when they use new Bluetooth Smart™ modules announced today by global technology leader Laird Technologies.
Anite, a global leader in wireless device testing technology, announced that it has been selected by CanvasM Technologies – a subsidiary of Tech Mahindra – one of world's leading test labs, to provide 2G, 3G and LTE conformance and interoperability test solutions in their new test laboratory in New Jersey.
Laird Technologies Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, announced it has expanded its EMI Metals product line with SMD Grounding Contacts. The EMI product line is a core piece of Laird’s value proposition to deliver solutions for today’s smaller, more advanced electronics. As part of Laird Performance Materials (LPM), these products provide vital protection for a wide range of high-performance electronic devices.