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Articles Tagged with ''booth''

Richardson RFPD at APEC 2013

Richardson RFPD Inc. announces its attendance and participation at the 2013 Applied Power Electronics Conference and Exposition (APEC). APEC focuses on the practical and applied aspects of the power electronics business, and it draws attendance from all facets of the industry, from manufacturers, designers and suppliers, to individuals involved in marketing and sales.


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Richardson RFPD at EDI CON 2013

Richardson RFPD Inc. announces its attendance and participation at EDI CON 2013. EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets.


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LPKF to exhibit PCB prototypes at the 2013 Electronics New England Expo

LPKF Laser & Electronics has announced it will exhibit at the 2013 Electronics New England Exposition, which takes place April 10-11 at the Boston Convention and Exhibition Center in Boston, MA. From booth 1019, LPKF will highlight its line of in-house rapid PCB prototyping equipment by creating boards with its best-selling PCB milling machine, the ProtoMat S63.


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AWR to sponsor and exhibit at EDI CON 2013

What: AWR is a gold sponsor at the Electronic Design Innovations Conference (EDI CON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, VSS™ system design software, as well as AXIEM® 3D planar EM software and Analyst™ 3D FEM EM software.


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Anaren and Emmoco partner to develop AIR support for BLE solution

Anaren Inc. announced that its Anaren Integrated Radio (AIR) module team is partnering with Austin, Texas-based middleware developer Emmoco to create the AIR Support for BLE solution. As a guest supplier at the Premier-Farnell booth (#220, Hall 5) in the Embedded World 2013 exhibition, the AIR team will be explaining its technology concept for fast-emerging Bluetooth Low Energy (BLE) applications -- and will also be actively developing a pool for "beta-testers" for the upcoming AIR Support for BLE solution, which is scheduled for release in the spring/summer of 2013.


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