Articles Tagged with ''booth''

Custom MMIC, (www.CustomMMIC.com), a developer of performance-driven monolithic microwave integrated circuits (MMICs), is pleased to announce the debut of several new GaAs MMIC amplifiers and mixers in booth #1807 at the International Microwave Symposium in Seattle, WA June 4-6th.

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials, will exhibit at the upcoming International Microwave Symposium (IMS) 2013 to be held in conjunction with the IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, and the ARFTG Microwave Measurement Conference. The exhibition takes place June 4-7, 2013 at the Washington State Convention Center located at 800 Convention Place in Seattle.

UltraSource Inc., an industry leader in delivering thin film on ceramic manufacturing solutions, will be showcasing several of its technologies at this year’s IMS 2013 held at the Washington State Convention Center in Seattle, Washington June 4-6. 

Auriga Microwave and Focus Microwaves, RF microwave industry market leaders, integrated their showcase systems, Auriga's AU4850 Pulsed IV/RF Characterization System and Focus' Harmonic Load-pull System to provide users unmatched measurement capabilities. Responding to market demands, Auriga and Focus have developed a software bridge to provide users harmonic pulsed load-pull measurement capability. The software will be offered by both companies through their respective sales channels.

AWR Corp., the innovation leader in high-frequency EDA software, is a gold sponsor and will offer a full agenda of activities at the International Microwave Symposium (IMS) 2013 that inform and educate attendees about new ways to use RF/microwave software for circuit and system design. IMS 2013 takes place from June 4 to 7 in Seattle, Washington.

RFMD will be exhibiting at IMS 2013 at booth 730. Explore the RFMD® industry-leading RF and microwave product portfolio with kiosks featuring solutions for WiFi and smart energy, wireless infrastructure, GaN RF power, and microwave MMICs.

NXP Semiconductors N.V. announced the availability of its ultra-wideband Doherty reference design using the BLF884P and BLF884PS – the industry’s first wideband Doherty power amplifiers capable of broadband operation (470 to 806 MHz). The new 70W DVB-T LDMOS designs bring the high-efficiency gains of Doherty topologies to broadcast transmitters, using NXP’s patent-pending architecture capable of operating over an ultra-wideband spectrum.

Rogers Corp. will highlight several of its high quality printed circuit board (PCB) materialsat the upcoming 2013 IEEE International Microwave Symposium (IMS).  Rogers’ Advanced Circuit Materials representatives will be on hand at exhibition booth #1459. In addition, John Coonrod, Rogers Market Development Engineer, will be presenting “Determining Circuit Material Dielectric Constant from Phase Measurements.” as part of the technical program.

Richardson RFPD Inc. announces its participation and schedule of presentations at the 2013 IEEE International Microwave Symposium (IMS), to be held in Seattle, Washington, June 2-7, 2013.

Richardson RFPD Inc. announces its attendance and participation at the M2M Zone at CTIA Wireless 2013. Presented by CTIA – The Wireless Association®, CTIA is a large wireless communications conference and exhibition that includes service operators, retailers, distributors, application providers, and more. The M2M Zone Conference and Pavilion showcases those companies in the dynamic M2M (machine-to-machine) segment of wireless communications.