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Articles Tagged with ''booth''
NXP Semiconductors N.V. announced the availability of its ultra-wideband Doherty reference design using the BLF884P and BLF884PS – the industry’s first wideband Doherty power amplifiers capable of broadband operation (470 to 806 MHz). The new 70W DVB-T LDMOS designs bring the high-efficiency gains of Doherty topologies to broadcast transmitters, using NXP’s patent-pending architecture capable of operating over an ultra-wideband spectrum.
Rogers Corp. will highlight several of its high quality printed circuit board (PCB) materialsat the upcoming 2013 IEEE International Microwave Symposium (IMS). Rogers’ Advanced Circuit Materials representatives will be on hand at exhibition booth #1459. In addition, John Coonrod, Rogers Market Development Engineer, will be presenting “Determining Circuit Material Dielectric Constant from Phase Measurements.” as part of the technical program.
Richardson RFPD Inc. announces its participation and schedule of presentations at the 2013 IEEE International Microwave Symposium (IMS), to be held in Seattle, Washington, June 2-7, 2013.
Richardson RFPD Inc. announces its attendance and participation at the M2M Zone at CTIA Wireless 2013. Presented by CTIA – The Wireless Association®, CTIA is a large wireless communications conference and exhibition that includes service operators, retailers, distributors, application providers, and more. The M2M Zone Conference and Pavilion showcases those companies in the dynamic M2M (machine-to-machine) segment of wireless communications.
LPKF Laser & Electronics has announced it will exhibit at the 2013 Design West Exposition, which takes place April 23-25 at the McEnery Convention Center in San Jose, CA. From booth 1646, LPKF will demonstrate its line of in-house rapid PCB prototyping equipment by creating boards on its top of the line PCB milling machine, the ProtoMat S103.
Richardson RFPD Inc. announces its attendance and participation at the 2013 Applied Power Electronics Conference and Exposition (APEC). APEC focuses on the practical and applied aspects of the power electronics business, and it draws attendance from all facets of the industry, from manufacturers, designers and suppliers, to individuals involved in marketing and sales.
Richardson RFPD Inc. announces its attendance and participation at EDI CON 2013. EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets.
LPKF Laser & Electronics has announced it will exhibit at the 2013 Electronics New England Exposition, which takes place April 10-11 at the Boston Convention and Exhibition Center in Boston, MA. From booth 1019, LPKF will highlight its line of in-house rapid PCB prototyping equipment by creating boards with its best-selling PCB milling machine, the ProtoMat S63.
What: AWR is a gold sponsor at the Electronic Design Innovations Conference (EDI CON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, VSS™ system design software, as well as AXIEM® 3D planar EM software and Analyst™ 3D FEM EM software.