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Articles Tagged with ''booth''

UltraSource to present thin film circuit design solutions at IMS 2013

May 28, 2013

UltraSource Inc., an industry leader in delivering thin film on ceramic manufacturing solutions, will be showcasing several of its technologies at this year’s IMS 2013 held at the Washington State Convention Center in Seattle, Washington June 4-6. 


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Auriga and Focus announce collaboration on a harmonic pulsed load-pull system

May 28, 2013

Auriga Microwave and Focus Microwaves, RF microwave industry market leaders, integrated their showcase systems, Auriga's AU4850 Pulsed IV/RF Characterization System and Focus' Harmonic Load-pull System to provide users unmatched measurement capabilities. Responding to market demands, Auriga and Focus have developed a software bridge to provide users harmonic pulsed load-pull measurement capability. The software will be offered by both companies through their respective sales channels.


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AWR announces agenda of activities for IMS 2013

May 21, 2013

AWR Corp., the innovation leader in high-frequency EDA software, is a gold sponsor and will offer a full agenda of activities at the International Microwave Symposium (IMS) 2013 that inform and educate attendees about new ways to use RF/microwave software for circuit and system design. IMS 2013 takes place from June 4 to 7 in Seattle, Washington.


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RFMD to exhibit at IMS 2013

May 21, 2013

RFMD will be exhibiting at IMS 2013 at booth 730. Explore the RFMD® industry-leading RF and microwave product portfolio with kiosks featuring solutions for WiFi and smart energy, wireless infrastructure, GaN RF power, and microwave MMICs.


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NXP delivers industry's first ultra-wideband Doherty amplifiers

May 21, 2013

NXP Semiconductors N.V. announced the availability of its ultra-wideband Doherty reference design using the BLF884P and BLF884PS – the industry’s first wideband Doherty power amplifiers capable of broadband operation (470 to 806 MHz). The new 70W DVB-T LDMOS designs bring the high-efficiency gains of Doherty topologies to broadcast transmitters, using NXP’s patent-pending architecture capable of operating over an ultra-wideband spectrum.


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Rogers shows advanced circuit material solutions and offers design guidance at IMS 2013

May 20, 2013

Rogers Corp. will highlight several of its high quality printed circuit board (PCB) materialsat the upcoming 2013 IEEE International Microwave Symposium (IMS).  Rogers’ Advanced Circuit Materials representatives will be on hand at exhibition booth #1459. In addition, John Coonrod, Rogers Market Development Engineer, will be presenting “Determining Circuit Material Dielectric Constant from Phase Measurements.” as part of the technical program.


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Richardson RFPD announces IMS 2013 schedule

May 8, 2013

Richardson RFPD Inc. announces its participation and schedule of presentations at the 2013 IEEE International Microwave Symposium (IMS), to be held in Seattle, Washington, June 2-7, 2013.


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Richardson RFPD at M2M Zone at CTIA Wireless 2013

April 24, 2013

Richardson RFPD Inc. announces its attendance and participation at the M2M Zone at CTIA Wireless 2013. Presented by CTIA – The Wireless Association®, CTIA is a large wireless communications conference and exhibition that includes service operators, retailers, distributors, application providers, and more. The M2M Zone Conference and Pavilion showcases those companies in the dynamic M2M (machine-to-machine) segment of wireless communications.


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PCB prototyping machine on display at Design West 2013

March 14, 2013

LPKF Laser & Electronics has announced it will exhibit at the 2013 Design West Exposition, which takes place April 23-25 at the McEnery Convention Center in San Jose, CA. From booth 1646, LPKF will demonstrate its line of in-house rapid PCB prototyping equipment by creating boards on its top of the line PCB milling machine, the ProtoMat S103.


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