- Buyers Guide
Articles Tagged with ''modeling''
COMSOL Inc., a leading global provider of engineering simulation software, announced the release of COMSOL Multiphysics® 4.4, the latest version of its powerful platform for the modeling and simulation of electrical, mechanical, fluid, and chemical applications.
Modelithics Inc. has collaborated with TriQuint Semiconductor Inc. to develop high-accuracy simulation models for five popular Gen II GaN Transistors from TriQuint, including the TGF2023-2-01, TGF2023-2-02, TGF2023-2-05, TGF2023-2-10 and TGF2023-2-20.
Astronomers using the new Atacama Large Millimeter/submillimeter Array (ALMA) have imaged a region around a young star where dust particles can grow by clumping together. This is the first time that such a dust trap has been clearly observed and modelled. It solves a long-standing mystery about how dust particles in discs grow to larger sizes so that they can eventually form comets, planets and other rocky bodies. The results are published in the journal Science on 7 June 2013.
Agilent Technologies Inc. announced the latest release of Electromagnetic Professional (EMPro), its 3-D electromagnetic simulation software.
COMSOL Inc., the leader in multiphysics simulation software, announced the release of major new additions to the COMSOL simulation platform. The latest version of COMSOL Multiphysics, version 4.3b, introduces five new application-specific modules and expanded modeling and analysis tools. Release highlights are available at www.comsol.com/4.3b.
MathWorks announced strengthened support for wireless communications and radar design with MATLAB and Simulink. Release 2013a now allow designers to speed up modeling and simulation within the familiar MATLAB and Simulink environments.
Agilent Technologies Inc. announced the newest release of SystemVue, its premier platform for designing communications and defense systems.
Mentor Graphics announced the new release of its HyperLynx® product featuring advanced 3D channel and trace modeling, improved DDR signoff verification, and accelerated simulation performance.
With IC-CAP 2013.01, Agilent introduces major improvements to its flagship product for high-frequency device modeling. One key improvement is turnkey extraction of the Angelov-GaN model, the industry standard compact device model for GaN semiconductor devices.
Agilent Technologies Inc. announced that its ongoing collaboration with Thales, a global technology leader for the defense and security and the aerospace and transport markets, has expanded the reach of X-parameters technology to wideband super-heterodyne receiver applications