Anritsu introduces TD-SCDMA signaling test capability for its industry-leading RTD solution. The new software enables chipset and mobile device makers to test their implementation of the 3G mobile communications standard used by China Mobile®.
Huber + Suhner opened its new state-of-the-art facility in Changzhou, East China, which will enable the company to manufacture products from all three core technologies – radio frequency, fiber optics and low frequency – in China.
Worldwide service revenue, year-on-year (YoY) for 4Q-2012 grew 2.8% to US$240.5 billion. From ABI Research’s investigations, the regional dynamic is varied. Western Europe and Africa’s mobile operator actually demonstrated a contraction in service revenue YoY of 8.2% and 6.9% respectively. Middle East, Latin America, and Asia-Pacific are still showing reasonably robust rates of growth of 7% to 11%.
AWR Corp., the innovation leader in high-frequency EDA software, announced the start of its AWR Design Forum 2013 tour with a diverse schedule of dates and venues in the Asia Pacific region starting this summer. ADF is an open event at which designers of microwave and RF circuits and systems such as MMIC, RF PCB, and LTE can network and share useful information and resources pertinent to high-frequency design, discuss AWR products and technologies, and collaborate on industry issues and trends. Details are available at http://www.awrcorp.com/ADF2013.
EDI CON 2013 - High-frequency electronic design engineers converged for learning and networking opportunities in Beijing. The event drew in excess of 2,000 attendees including over 1,100 unique conference delegates, over 800 visitors and exhibitors and more than 30 members of the press.
AWR Corp., the innovation leader in high-frequency EDA software, announced the sponsorship of two major student design competitions in China as part of the company’s continuing focus on working with universities worldwide to empower students with RF/microwave software tool experience and jumpstart their engineering careers.
What: AWR is a gold sponsor at the Electronic Design Innovations Conference (EDI CON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, VSS™ system design software, as well as AXIEM® 3D planar EM software and Analyst™ 3D FEM EM software.
Richardson RFPD Inc. announces its participation and the line-up of suppliers and products it will feature at IIC China 2013, to be held at the Shenzhen Convention & Exhibition Center, Shenzhen, China, February 28 to March 2, 2013.