EDI CON China 2016 set new records for attendance and sponsorship, with more than 3,100 unique attendees — including 1,855 delegates. Attendance grew by 35 percent, and the exhibition grew by 32 percent, making it the largest RF/microwave, EMC/EMI and high-speed digital design event in China.
At EDI CON China 2016 Thomas W. Crowe, President of Virginia Diodes Inc. gave Microwave Journal an insight into the company’s background, its focus on very high frequencies, its current activities in China and future technology developments.
EDI CON China 2016 took place April 19-21 in Beijing at the China National Convention Center (CNCC). Continuing on a strong trajectory of growth, EDI CON China achieved a 35 percent increase in attendees and 32 percent increase in exhibition space over 2015. This year’s conference included partnerships with the China Radar Industry Association Conference and EMC China Conference/Exhibition.
Richardson RFPD Inc. announced its sponsorship of the Electronic Design Innovation Conference China (EDI CON) 2016 GaN Panel and Small Cell Workshop events. EDI CON China 2016 will be held from April 19-21 at the China National Convention Center in Beijing, China.
NI announces that NI AWR Design Environment™ V12 will be highlighted at the Electronic Design Innovation Conference (EDI CON) 2016, being held in Beijing, China April 19-21. In addition to demonstrations in NI Booth #315, the software will be featured in two 40-minute workshops.
Richardson Electronics Ltd. announces its participation at EDI CON CHINA 2016. The Electronic Design Innovation Conference (EDI CON) brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers.