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Articles Tagged with ''china''

Teseq calibration lab in China gains accreditation

May 23, 2014

Teseq’s calibration laboratory in Beijing, China, is the first accredited EMC calibration lab in China for the AMETEK Compliance Test Solutions group.


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TriQuint appoints new distributor in China for its mobile RF solutions

May 22, 2014

TriQuint Semiconductor Inc., a leading RF solutions supplier and technology innovator, announced the appointment of Upstar Technology as its new distributor in China for TriQuint high-performance mobile products.


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TriQuint moves 4G forward in greater China with six major chipset providers

May 13, 2014

TriQuint Semiconductor, Inc., a leading RF solutions supplier and technology innovator, announced that its advanced filtering solutions and multi-band, multi-mode PA modules (MMPAs) for LTE smartphones have captured nearly 20 reference design wins with all six major chipset providers in greater China.


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Huber + Suhner cable assemblies for antennas employed by NSN in China

April 28, 2014

The leading mobile services provider in Mainland China, NSN, is now deploying 4G/LTE technology, which uses LISCA cable assemblies from Huber + Suhner for the mobile communications antennas.


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China NIM selects Anritsu VectorStar™ broadband system

April 23, 2014

Anritsu Corporation Microwave Measurement Division (MMD) announces that the China National Institute of Metrology (NIM) Microwave Parameters Lab has selected the Anritsu VectorStar™ ME7838A 110 GHz broadband Vector Network Analyzer (VNA) system. The lab will use the advanced test solution to develop standards for on-wafer S-parameter calibration procedures.


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AWR presents and exhibits at EDI CON 2014

April 7, 2014

AWR will be presenting and demonstrating its soon-to-be released V11 NI AWR Design Environment™ at EDI CON 2014 in Beijing, China starting April 8 and running through April 10, 2014.  V11, the first major software release in 2014, includes new features, functionality and enhancements to Microwave Office®/Analog Office® circuit design software, Visual System Simulator™ (VSS) system design software, AXIEM® 3D planar electromagnetic (EM) software, and Analyst™ 3D finite element method (FEM) EM software. Demonstrations within booth #301 will showcase V11 new features and functionality and in particular the new user-customizable PCell capability and antenna measurements within Analyst.


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MVG announces participation in EDI CON 2014

April 3, 2014

The 2nd Electronic Design Innovation Conference (EDI CON) is already in sight! Microwave Vision Group (MVG) is pleased to announce its participation in this event which will be held in the Beijing International Convention Center, April 8 -10, 2014.


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Asia-Pacific set to dominate $35B macro RAN market in 2014

April 2, 2014

According to ABI Research, Asia-Pacific regional growth in basestations will outpace all other regions this year as it continues to account for the majority of worldwide basestation deployments. The Asia-Pacific region now becomes the largest market for LTE, followed by North America and Western Europe, with the Asia-Pacific regional installed base growing to 8X in 2014.


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Richardson RFPD announces sponsorship of Small Cell Workshop at EDI CON 2014

March 26, 2014

Richardson RFPD Inc. announced its sponsorship of a small cell workshop at the 2014 Electronic Design Innovation Conference (EDI CON).


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NXP strengthens China team

March 24, 2014

NXP Semiconductors has appointed Li Zheng as Senior Vice President Sales & Marketing, Greater China and Country Manager for China, who will be based in Shanghai.


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