advertisment Advertisement
This ad will close in  seconds. Skip now
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement

Articles Tagged with ''film''

IMS introduces HVI series high voltage surface mount chip resistors to 3kV

MMICs&More
January 29, 2013

International Manufacturing Services Inc. (IMS) introduces its line of HVI Series chip resistors especially suited for high voltage applications.


Read More

UltraSource announces backside treatment for thin film epoxy adhesion

February 14, 2013

UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that the company now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding. 


Read More

Bonding Source offers epoxy film press

March 5, 2013

Bonding Source introduces the most versatile epoxy board mount press in the industry. The press is used to attach PCBs to carriers and housings with epoxy film. The press utilizes house air and works off a pneumatic piston to control the psi required for curing film epoxies under pressure.


Read More

UltraSource releases application note: How CAD file quality affects thin film design success

March 26, 2013

Michael Casper, president and CEO of UltraSource Inc., a thin film microchip manufacturer, is pleased to announce the update of an application note on the company's website titled: “How Your CAD File Affects the Success of Your New Thin Film Design.”


Read More

IMS releases compact thick film 7 GHz SMT Wilkinson power divider

May 23, 2013

International Manufacturing Services Inc. (IMS), a leading manufacturer and supplier of high quality thick film chip resistors, terminations, attenuators and other RF components to the electronics industry, announces the availability of its compact Thick Film 7GHz SMT Wilkinson Power Divider.


Read More

UltraSource to present thin film circuit design solutions at IMS 2013

May 28, 2013

UltraSource Inc., an industry leader in delivering thin film on ceramic manufacturing solutions, will be showcasing several of its technologies at this year’s IMS 2013 held at the Washington State Convention Center in Seattle, Washington June 4-6. 


Read More

UltraSource releases capabilities addition on ultra-thin substrates

May 30, 2013

Michael Casper, president & CEO of UltraSource Inc., an industry leader in delivering  thin film on ceramic microchip manufacturing solutions, is pleased to announce the formalized addition of a new fabrication processing note on the company's website under Capabilities/Solutions titled: Ultra-Thin Substrates -- “Thin is In! (And We Can Help)”. 


Read More

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up