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Articles Tagged with ''film''
Barry Industries, an ISO9001:2008 certified, ITAR registered manufacturer of high quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging, introduces a RoHS compliant flange mount termination which dissipates 800 W with minimal return loss over a DC to 1 GHz bandwidth.
Barry Industries, an ISO9001:2008 certified, ITAR registered manufacturer of high quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging, introduces a new 0904 size chip attenuator for Ku, K and Ka Bands. The AV0904GA attenuator has been characterized to 30 GHz, features gold wirebondable I/O terminals with epoxy mount ground pads and is rated to 750 mW. Typical VSWR is 1.20:1 from DC to 18 GHz and 1.50:1 to 30 GHz.
Rogers to offer material solutions for high-frequency, high-thermal-reliability & multilayer circuits at PCB West 2013
Rogers Corp. will have representatives available to discuss electronic printed-circuit-board (PCB) material solutions at the PCB West Exhibition (http://pcbwest.com), September 25, 2013, in the Santa Clara Convention Center in Santa Clara, CA (Booth #200).
Cree’s GaN RF technology played a critical behind-the-scenes role in the upcoming action film, “Escape Plan,” starring Sylvester Stallone and Arnold Schwarzenegger. The film features aerial stunt sequences captured using a low-latency HD camera and transmitter and Array Wireless’ S-Band linear power amplifier, which employs Cree’s world-class GaN HEMT semiconductors to meet the stringent linearity requirements for wide bandwidth HD digital transmission.
Array Wireless Inc., a technology leader in the creation of efficient, high linearity microwave power amplifiers, announced that its enabling amplifier technology was successfully used to support the filming of aerial stunt sequences for the upcoming movie “Escape Plan,” starring Sylvester Stallone and Arnold Schwarzenegger.
Michael Casper, president & CEO of UltraSource Inc., an industry leader in delivering thin film on ceramic microchip manufacturing solutions, is pleased to announce the formalized addition of a new fabrication processing note on the company's website under Capabilities/Solutions titled: Ultra-Thin Substrates -- “Thin is In! (And We Can Help)”.
UltraSource Inc., an industry leader in delivering thin film on ceramic manufacturing solutions, will be showcasing several of its technologies at this year’s IMS 2013 held at the Washington State Convention Center in Seattle, Washington June 4-6.
International Manufacturing Services Inc. (IMS), a leading manufacturer and supplier of high quality thick film chip resistors, terminations, attenuators and other RF components to the electronics industry, announces the availability of its compact Thick Film 7GHz SMT Wilkinson Power Divider.
Michael Casper, president and CEO of UltraSource Inc., a thin film microchip manufacturer, is pleased to announce the update of an application note on the company's website titled: “How Your CAD File Affects the Success of Your New Thin Film Design.”
Bonding Source introduces the most versatile epoxy board mount press in the industry. The press is used to attach PCBs to carriers and housings with epoxy film. The press utilizes house air and works off a pneumatic piston to control the psi required for curing film epoxies under pressure.