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Articles Tagged with ''film''
Rogers Corp. will be promoting its industry-leading printed circuit board (PCB) materials at the IPC APEX EXPO, being held March 25-27, 2014 at the Mandalay Bay Resort & Convention Center (Las Vegas, NV). The IPC APEX EXPO, with more than 400 exhibiting companies and thousands of attendees, is a leading industry event for professionals involved in PCB design and manufacturing and electronic assembly and test.
Vishay Intertechnology Inc. announced that the company is now offering laboratory sample kits of its automotive-grade precision thin film chip resistors. The MCW 0406 AT (LCW AT 96/4) and MCT 0603 AT (LCT AT 96/4) kits aid engineers in prototyping, and speed time to market in a wide range of electronic systems.
Vishay Intertechnology Inc. introduced a new series of thick film chip resistors for high-power, surface-mount RF applications. Offered in the compact 1206 case size, the Vishay Dale RCP series devices feature a power rating of 1 W at +70°C with a standard board mount and up to 11 W with active temperature control.
Rogers Corp. Advanced Circuit Materials Division launched COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) Film providing reliable high temperature performance.
Barry Industries, an ISO9001:2008 certified, ITAR registered manufacturer of high quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging, introduces a RoHS compliant flange mount termination which dissipates 800 W with minimal return loss over a DC to 1 GHz bandwidth.
Barry Industries, an ISO9001:2008 certified, ITAR registered manufacturer of high quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging, introduces a new 0904 size chip attenuator for Ku, K and Ka Bands. The AV0904GA attenuator has been characterized to 30 GHz, features gold wirebondable I/O terminals with epoxy mount ground pads and is rated to 750 mW. Typical VSWR is 1.20:1 from DC to 18 GHz and 1.50:1 to 30 GHz.
Rogers to offer material solutions for high-frequency, high-thermal-reliability & multilayer circuits at PCB West 2013
Rogers Corp. will have representatives available to discuss electronic printed-circuit-board (PCB) material solutions at the PCB West Exhibition (http://pcbwest.com), September 25, 2013, in the Santa Clara Convention Center in Santa Clara, CA (Booth #200).
Cree’s GaN RF technology played a critical behind-the-scenes role in the upcoming action film, “Escape Plan,” starring Sylvester Stallone and Arnold Schwarzenegger. The film features aerial stunt sequences captured using a low-latency HD camera and transmitter and Array Wireless’ S-Band linear power amplifier, which employs Cree’s world-class GaN HEMT semiconductors to meet the stringent linearity requirements for wide bandwidth HD digital transmission.
Array Wireless Inc., a technology leader in the creation of efficient, high linearity microwave power amplifiers, announced that its enabling amplifier technology was successfully used to support the filming of aerial stunt sequences for the upcoming movie “Escape Plan,” starring Sylvester Stallone and Arnold Schwarzenegger.
Michael Casper, president & CEO of UltraSource Inc., an industry leader in delivering thin film on ceramic microchip manufacturing solutions, is pleased to announce the formalized addition of a new fabrication processing note on the company's website under Capabilities/Solutions titled: Ultra-Thin Substrates -- “Thin is In! (And We Can Help)”.