- Buyers Guide
Rogers Corp. and representatives of its Advanced Circuit Materials Division will be at the upcoming 2012 IEEE International Microwave Symposium (IMS) to help attendees learn more about Rogers’ wide range of high frequency circuit materials.
UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.
NuSil Technology LLC (http://www.nusil.com), a formulator and manufacturer of silicone compounds for the aerospace, aircraft, electronics and photonics industries, announces the release of CV-2681-12, an electrically conductive, controlled volatility (low outgassing) film adhesive designed for a wide range of applications, from tacking down wires to working with solar cells and mirrors.
Vishay Intertechnology Inc. introduced a new series of radial-leaded, positive temperature coefficient (PTC) thermistors. Devices in the new TFPTL <http://www.vishay.com/doc?33027> series feature nickel thin film elements with positive temperature coefficients of + 4110 ppm/K, fast response time of < 2 s, and high stability over a wide temperature range from - 55 to + 150 °C.
Cornell Dubilier Electronics Inc. announced that it has acquired the Orange Drop® film capacitor product lines and all other radial product lines from capacitor maker SBE Inc. (dba SB Electronics) of Barre, VT.
Vishay Intertechnology Inc. introduced the industry's first wirebondable thin film chip resistors with compact 40 x 40 mil (1 x 1 mm) footprints to feature high resistance to 100 MΩ. The new CS44 <http://www.vishay.com/doc?60114> series features low TCR down to ± 50 ppm/°C and tolerances to ± 0.5 %.
Vishay Precision Group Inc. announced that its Vishay Foil Resistors (VFR) brand has released a new video that compares the stability and accuracy of three different current sense precision resistor technologies used in solar panels: thick film, metal band, and next-generation Bulk Metal® Z-Foil. The short video demonstrates how an increase in ambient temperature results in a change in accuracy and stability in thick film and metal band resistors; but has no effect on the Z-Foil resistor.
Laird Technologies Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, announced the release of its new eTEG Series Thin Film Energy Harvesting product line.
Stackpole's RAVN Series is a thin film based chip array designed for applications with tight tolerance or tight TCR requirements. The Series offers four resistive elements in a 1.6 x 3.2 mm package with resistance values from 100 Ω up to 33 K Ω in a 0.1 percent tolerance.
Michael Casper, president and CEO of UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the company's existing patented UltraVia™ process. The CopperVia was first introduced at the June2012 IEEE MTT-S International Microwave Symposium/Exhibition inMontreal, Quebec, Canada.
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