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Articles Tagged with ''high''

Peregrine introduces industry's highest-isolation RF switch for wireless infrastructure market

Peregrine Semiconductor Corp.
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Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs), announced availability of the industry’s highest-isolation SPDT RF switch for the wireless infrastructure market. The UltraCMOS® based PE42420 RF switch has high isolation of 64 dB @ 4 GHz — an approximately 20% increase over competing devices on the market.* Additionally, the switch features HaRP™ technology enhancements to deliver high linearity, with an IIP3 of 65 dBm.


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EMC Technology introduces DC to 26 GHz coaxial attenuator

EMC Technology Inc.
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EMC Technology, a Smiths Microwave business, introduces the new 42UW series of high performance coaxial fixed attenuators, manufactured to meet the environmental requirements of MIL-DLT-3933.  These coaxial attenuators offer superior attenuation accuracy and VSWR, with extended broadband frequency operation from DC to 26 GHz. 


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Keithley adds high power wafer-level testing to ACS software

Software/EDA
Keithley Instruments Inc.
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Keithley Instruments Inc. announces enhancements to its Automated Characterization Suite (ACS) software that support its expanding family of high power semiconductor characterization solutions. 


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Skyworks supports automotive infotainment systems for global car manufacturers

Skyworks Solutions Inc.
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Skyworks Solutions Inc. announced that its industry-leading silicon-on-insulator (SOI) switching technology is now being utilized by European, Japanese, Korean and North American car manufacturers for advanced infotainment systems. Specifically, Skyworks’ solid state technology is enabling seamless low noise and broadband switching between audio, Blu-ray/DVD, navigation, cell phone and vehicle security display inputs as well as a variety of other high bandwidth media sources in automobiles.


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IMS introduces HVI series high voltage surface mount chip resistors to 3kV

MMICs&More
International Manufacturing Services Inc. (IMS)
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International Manufacturing Services Inc. (IMS) introduces its line of HVI Series chip resistors especially suited for high voltage applications.


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Ardent's compression mount connector ideal for high speed SerDes and advanced applications

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Ardent Concepts has announced the availability of a new, patented, high density termination assembly solution for true 40 Gbps/40 GHz coaxial-to-PCB transition. The Terminate-R™ from Ardent Concepts is a compression mount (solderless) connector designed to provide the lowest loss interface between multiple lanes of high speed digital channels on a PCB to another PCB or measurement instrumentation.


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Richardson RFPD introduces ultra low noise, high linearity LNA from TriQuint

Richardson RFPD Inc.
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Richardson RFPD Inc. announces immediate availability and full design support capabilities for a new internally matched, low noise amplifier (LNA) in a small 2x2mm DFN package from TriQuint Semiconductor Inc. (TriQuint).


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AMCAD launches a new 1kV/ 30A pulse IV system for testing HVFS transistors

AMCAD Engineering
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AMCAD Engineering announced the upgrade of its PIV semiconductor device analyzer family for the next generation of High Voltage Fast Switching (HVFS) Transistors.


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Aethercomm introduces a high power GaN SSPA

Aethercomm Inc., Carlsbad, CA
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Aethercomm Inc., has recently completed a high power SSPA using a Gallium Nitride (GaN) with a frequency range covering 2.9 to 3.1 GHz: Aethercomm part number SSPA 2.9-3.1-300. The devices in this amplifier design are not matched, therefore the frequency band is scalable from 2.7 to 2.9 GHz or 2.7 to 3.5 GHz with similar performance. This high power SSPA produces 300 to 400 watts peak output power.


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EDI CON 2013 announces new participants

EDI CON
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EDI CON 2013 (March 12-14, Beijing, China), the industry-driven event for RF, microwave and high speed digital electronic design announces the recent addition of several leading RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers as participants in the technical program and exhibition. As solution providers in high frequency electronic design and system integration, experts from these companies will offer attendees the latest information on the technology used in today’s communications and aerospace industries.


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