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Articles Tagged with ''high''
Keithley Instruments Inc. announces enhancements to its Automated Characterization Suite (ACS) software that support its expanding family of high power semiconductor characterization solutions.
Skyworks Solutions Inc. announced that its industry-leading silicon-on-insulator (SOI) switching technology is now being utilized by European, Japanese, Korean and North American car manufacturers for advanced infotainment systems. Specifically, Skyworks’ solid state technology is enabling seamless low noise and broadband switching between audio, Blu-ray/DVD, navigation, cell phone and vehicle security display inputs as well as a variety of other high bandwidth media sources in automobiles.
International Manufacturing Services Inc. (IMS) introduces its line of HVI Series chip resistors especially suited for high voltage applications.
Ardent Concepts has announced the availability of a new, patented, high density termination assembly solution for true 40 Gbps/40 GHz coaxial-to-PCB transition. The Terminate-R™ from Ardent Concepts is a compression mount (solderless) connector designed to provide the lowest loss interface between multiple lanes of high speed digital channels on a PCB to another PCB or measurement instrumentation.
Richardson RFPD Inc. announces immediate availability and full design support capabilities for a new internally matched, low noise amplifier (LNA) in a small 2x2mm DFN package from TriQuint Semiconductor Inc. (TriQuint).
AMCAD Engineering announced the upgrade of its PIV semiconductor device analyzer family for the next generation of High Voltage Fast Switching (HVFS) Transistors.
Aethercomm Inc., has recently completed a high power SSPA using a Gallium Nitride (GaN) with a frequency range covering 2.9 to 3.1 GHz: Aethercomm part number SSPA 2.9-3.1-300. The devices in this amplifier design are not matched, therefore the frequency band is scalable from 2.7 to 2.9 GHz or 2.7 to 3.5 GHz with similar performance. This high power SSPA produces 300 to 400 watts peak output power.
EDI CON 2013 (March 12-14, Beijing, China), the industry-driven event for RF, microwave and high speed digital electronic design announces the recent addition of several leading RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers as participants in the technical program and exhibition. As solution providers in high frequency electronic design and system integration, experts from these companies will offer attendees the latest information on the technology used in today’s communications and aerospace industries.
M/A-COM Technology Solutions Inc. introduced a new high voltage CMOS driver for PIN diodes for use in military and commercial radio applications. The MADR-010574 is designed to work with M/A-COM Tech’s high power and high voltage PIN diodes.
Horizon House has announced plans to launch the inaugural Electronic Design Innovation Conference (EDI CON 2013) in Beijing, China in March 2013 that will focus on design concepts and techniques of RF, microwave and high-speed digital components and systems in China